Authors: J.G. Korvink, M. Emmenegger, S. Taschini and H. Baltes
Affilation: ETH Zürich, Switzerland
Pages: 5 - 10
Keywords: CMOS, MEMS, compact model, model reduction, SPICE, finite element method, boundary element method
The most appropriate tools for the modelling and simulation of MEMS are strongly related to the technology used to fabricate them. CMOS MEMS are naturally combined with circuitry, and in a packaged form they are capable microsystems. The numerical models of the microsystems therefore have to include the domains and effects of the microsensors, microactuators, the CMOS circuitry and the packaoing. To enable the use of such comprehensive models, we employ compact modelling techniques. The methods are removing the sharp distinction between "lumped" and "continuous" numerical models. This review illustrates recent work we have done in this area.