Authors: R.W. Dutton, E.K. Chan, N.W. Wilson, Z-K Hsiau and S. Shen
Affilation: Stanford University, United States
Pages: 1 - 4
Keywords: geometry modeling, process simulation
The potency of the silicon IC technology base, its use of CAD for design targeted for manufacturing and the related challenges faced in deployment of MEMS are discussed. The rapidly growing field of MEMS has created opportunities to merge new functional capabilities with integrated circuit (IC) electronics. MEMS fabrication uniquely requires accurate prediction of both geometry and materials dependencies that affect electrical, mechanical and other structurally constrained behavior.