Authors: E.M. Ochoa, L.A. Starman_Jr., W.D. Cowan, T.R. Nelson_Jr., O. Blum Spahn and J.A. Lott
Affilation: Air Force Institute of Technology, United States
Pages: 266 - 269
Keywords: WDM, MEMS, tunable filter, tunable VCSEL, hybrid integration
We characterize our novel mechanical structures for flip-bonded hybrid micro-electro-mechanically (MEM) tunable filters (MEM-TF) and MEM-tunable vertical cavity surface emitting lasers (MEM-TVCSELs) by comparing simulations with foundry fabricated actuators. Two of our prototypes, each with different flexure thickness, have analytically simulated and measured pull-in voltages of (11.6 V, 11.8 ± 0.1 V) and (8.4 V, 7.7 ± 0.5 V) respectively. We believe our hybrid approach will reduce cost, shorten development time, enable use of standard flip-chip technology and IC/MEMS foundries, and offer materials flexibility since the components do not need to be lattice matched.