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 | Nanotech 2002 Vol. 1
Technical Proceedings of the 2002 International Conference on Modeling and Simulation of Microsystems
Chapter 4: Optimization, Co-Simulation |
| | Thermal and Load-Deflection FE Analyses of Parylene Diaphragms | | Authors: | W. Sim, B. Kim, B. Choi and J-O Park | | Affilation: | Intelligent Microsystem Center, Korea | | Pages: | 210 - 213 | | Keywords: | parylene, corrugated diaphragm, load-deflection, residual stress | | Abstract: | In this study, the finite-element method(FEM) is employed in order to analyze the mechanical behavior of parylene diaphragm. Thermal and load-deflection FE analyses of flat and corrugated parylene diaphragm are performed to find an effect of the residual stress on the stiffness of the diaphragm. The simulation results show that the mechanical sensitivity of diaphragm is greatly influenced by the residual stress caused by the thermal process(silicon wet etching). The measurement is consistent with simulation result that takes the effect of residual stress into account. Optimum shape of corrugated diaphragm that considers the corrugation depth and number is determined. |  | View paper | | ISBN: | 0-9708275-7-1 |
| Pages: | 764 |
| Hardcopy: | $100.00 |
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