Nanotech 2002 Vol. 1
Nanotech 2002 Vol. 1
Technical Proceedings of the 2002 International Conference on Modeling and Simulation of Microsystems

Circuit Simulation Chapter 12

Compact Thermal Model for Transient Temperature Fields in Electronic Systems
Y.C. Gerstenmaier and G. Wachutka
Munich University of Technology, DE

An Algorithm for the Inclusion of RC Compact Models of Packages into Board Level Thermal Simulation Tools
M. Rencz, V. Székely and B. Courtois
TIMA-CMP, FR

Physics-Based and Compact Models for Self-Heating in High-Speed Bipolar Integrated Circuits
A. Pacelli, P. Palestri and M. Mastrapasqua
State University of New York-Stony Brook, US

Extraction of Coupled RLC Network from Multi-level Interconnects for Full Chip Simulation
S. Yoon and T. Won
Inha University, KR

Simulation of Heterojunction Bipolar Transistor with Domain Decomposition Method
Y. Zhang and P.P. Ruden
Oklahoma State University, US

Compact Modeling of Tunneling Breakdown in PN Junctions for Computer-Aided ESD Design (CAD for ESD)
Y. Subramanian and R.B. Darling
University of Washington, US

Characterization of “Multipath Interconnects” for Microelectronic and Nanotechnology Circuits
A.K. Goel and N.R. Eady
Michigan Technological University, US

Novel Computing Architecture on Arrays of Josephson Persistent Current Bits
J. Han and P. Jonker
Delft University of Technology, LN

The New Approach to the Power Semiconductor Devices Modelling
L. Starzak, M. Zubert and A. Napieralski
Technical University of Lodz, PL


ISBN: 0-9708275-7-1
Pages: 764