Nano Science and Technology Institute
Nanotech 2001 Vol. 1
Nanotech 2001 Vol. 1
Technical Proceedings of the 2001 International Conference on Modeling and Simulation of Microsystems
Chapter 9: Process Modeling

Bonding Pad Resistance. A Combined Approach

Authors:G. Bouche, R. Gonella and E. Sabouret
Affilation:Technology Modeling STMicroelectronics, FR
Pages:442 - 445
Keywords:bonding pad, mechanical stress, simulation, reli-ability, compression test
Abstract:Introducing new intermetal materials, with improved electrical properties but lowered mechanical resistance, requires in terms of reliability to design new structures for pads. The test structures under fabrication have been simulated to try and evaluate the state of stress under various loads in the structures: the analysis of the results aims at supporting the choice of a specific type of structure and optimizing the parameters of this structure. The present work will help analyze further experimental data under compressive stress.
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