Nanotech 2001 Vol. 1
Nanotech 2001 Vol. 1
Technical Proceedings of the 2001 International Conference on Modeling and Simulation of Microsystems

Semiconductor Device Modeling and Novel Structures Simulation Chapter 10

3-D Simulation and Modeling of Signal Isolation in RF/IF Circuits

Authors: S. Bharatan, P. Welch, K.H. To, R. Thoma and M. Huang

Affilation: Motorola, Digital DNA Laboratories, United States

Pages: 470 - 473

Keywords: signal isolation, compact modeling, substrate coupling, on-chip crosstalk

Abstract:
In this paper, we present a practical methodolgy for the 3-dimensional simulation of signal isolation structures along with comparison to measurements made on test structures. We also describe the extraction of a scalable compact model for isolation structures. Such SPICE models are mandatory during the design process for predicting the effect of substrate noise generated by digital circuit blocks on highly sensitive low noise amplifiers in the RF and IF range.

3-D Simulation and Modeling of Signal Isolation in RF/IF Circuits

ISBN: 0-9708275-0-4
Pages: 638