Authors: S. Bharatan, P. Welch, K.H. To, R. Thoma and M. Huang
Affilation: Motorola, Digital DNA Laboratories, United States
Pages: 470 - 473
Keywords: signal isolation, compact modeling, substrate coupling, on-chip crosstalk
In this paper, we present a practical methodolgy for the 3-dimensional simulation of signal isolation structures along with comparison to measurements made on test structures. We also describe the extraction of a scalable compact model for isolation structures. Such SPICE models are mandatory during the design process for predicting the effect of substrate noise generated by digital circuit blocks on highly sensitive low noise amplifiers in the RF and IF range.