Signal Integrity Simulation and Verification

	MSM 2000 Technical Proceedings of the 2000 International Conference on Modeling and Simulation of Microsystems Chapter 9: Signal Integrity Simulation and Verification
-	Inductance Calculation in Interconnect Structures
	C. Harlander, R. Sabelka and S. Selberherr
	Technical University of Vienna, Austria
-	Influence of Element Size on the Precision and Required Computational Effort for 3D FEM Interconnect Capacitance Simulations of ULSI DRAM Cells
	A. Hieke
	Infineon Technologies Corporation, U.S.A.
-	Hybrid P-Element and Trefftz Method for Capacitance Computation
	M. Gyimesi, J-S. Wang and D.F. Ostergaard
	ANSYS, Inc., U.S.A.
-	Wavelet Based Matrix Compression in Numerical Micromagnetics
	T. Schrefl, D. Süss and J. Fidler
	Vienna University of Technology, Austria
-	Transient Simulation of Ferroelectric Hysteresis
	K. Dragosits, R. Hagenbeck and S. Selberherr
	Technical University of Vienna, Austria
-	A Methodology for Modeling a Complex Geometry on Wafer from a Layout Data
	S. Yoon, O. Kwon and T. Won
	Inha University, Korea
ISBN:	0-9666135-7-0
Pages:	741
Special:	3 CD Set — 15% off with Free Shipping
Up