Authors: M. Rencz, V. Székely, Zs. Kohári and B. Courtois
Affilation: Micred Ltd., Hungary
Pages: 209 - 212
Keywords: reduced order models, thermal models, package models
MEMS applications are frequently thermally operated, so knowing the thermal characteristics of their packages is very important. This paper presents a method for the generation of reduced order dynamic thermal models, either from simulated or from measured transient results. The applicability of the method is presented on a benchmark package used for (pressure) sensor applications.