A Method for Thermal Model Generation of MEMS Packages

	MSM 2000 Technical Proceedings of the 2000 International Conference on Modeling and Simulation of Microsystems Chapter 5: Equivalent Circuits, Behavioral and Multi-Level Simulation
	A Method for Thermal Model Generation of MEMS Packages
Authors:	M. Rencz, V. Székely, Zs. Kohári and B. Courtois
Affilation:	Micred Ltd., HU
Pages:	209 - 212
Keywords:	reduced order models, thermal models, package models
Abstract:	MEMS applications are frequently thermally operated, so knowing the thermal characteristics of their packages is very important. This paper presents a method for the generation of reduced order dynamic thermal models, either from simulated or from measured transient results. The applicability of the method is presented on a benchmark package used for (pressure) sensor applications.
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ISBN:	0-9666135-7-0
Pages:	741
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