Equivalent Circuits, Behavioral and Multi-Level Simulation

	MSM 2000 Technical Proceedings of the 2000 International Conference on Modeling and Simulation of Microsystems Chapter 5: Equivalent Circuits, Behavioral and Multi-Level Simulation
-	Development of an FET Pressure Sensor Model and used to Predict Sensor Behaviour as a Function of Electrode Geometry
	E. Hynes, P. Elebert, M. O'Neill, H. Berney, W.A. Lane, G. Kelly and M. Hill
	Analog Devices, IR
-	An Improved BDJ Photodetector Physical Model Implemented Under SPICE
	A. Alexandre, M. BenChouikha, M. Sedjil and G. Alquié
	Université Pierre et Marie Curie, FR
-	Investigation of Cross-Coupling and Parasitic Effects in Microelectromechanical Devices on Device and System Level
	G. Schrag, G. Zelder and G. Wachutka
	Munich University of Technology, DE
-	Integration of a Permeable Layer into Micro Coil Modelling and First Steps of Automatic Optimization
	S. Rehfuß, D. Peters and R. Laur
	University of Bremen (ITEM), DE
-	Generation of a Metamodel for a Micromachined Accelerometer using T-SpiceTM and the Iz-Optimality Option of I-OPTTM
	H.J. Lee, S.B. Crary, B Affour, D. Bernstein, Y.B. Gianchandani, D.M. Woodcock and M.A. Maher
	MEMSCAP S.A., FR
-	Low Order Squeeze Film Model for Simulation of MEMS Devices
	S. Vemuri, G.K. Fedder and T. Mukherjee
	Carnegie Mellon Universtiy, US
-	A Method for Thermal Model Generation of MEMS Packages
	M. Rencz, V. Székely, Zs. Kohári and B. Courtois
	Micred Ltd., HU
-	Techniques for Coupled Circuit and Micromechanical Simulation
	J. Chen and S-M. Kang
	University of Illinois at Urbana-Champaign, US
-	Electromechanical Analysis of Micromechanical SOI-Fabricated RF Resonators
	T. Lamminmäki, K. Ruokonen, I. Tittonen, T. Mattila, O. Jaakkola, A. Oja, H. Seppä, P. Seppälä and J. Kiihamäki
	Helsinki University of Technology, FI
-	A FEM Based Network Approach for the Simulation of Miniaturized Electromagnetic Devices
	R. Gollee and G. Gerlach
	Dresden University of Technology, DE
-	A Synthesizable Low Power VHDL Model of the Exact Solution of Three Dimensional Hyperbolic Positioning System
	R. Bucher and D. Misra
	New Jersey Center for Wireless and Telecommunication, US
-	Compact Models for Smart Pixels with Smart Illumination
	Y. Subramanian, M. Azadeh and R.B. Darling
	University of Washington, US
-	Hardware Realization of Biological Mechanisms Using VHDL and FPGAs
	N. Botros, M. Akaaboune, J. Alghazo and M. Alhreish
	Southern Illinois University, US
-	Modeling of High-speed Diamond Microswitch
	P. Schmid, M. Adamschik, S. Ertl and E. Kohn
	University of Ulm, DE
ISBN:	0-9666135-7-0
Pages:	741
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