Process Modeling

	MSM 2000 Technical Proceedings of the 2000 International Conference on Modeling and Simulation of Microsystems Chapter 2: Process Modeling
-	Automated Mask-Layout and Process Synthesis for MEMS
	L. Ma and E.K. Antonsson
	California Institute of Technology, U.S.A.
-	Creation of 3D Surface Models from 2D Layouts for BEM Anaylysis
	M. Spasojevic, P. Ljung and M. Bächtold
	Coyote Systems, Inc., U.S.A.
-	Process Simulation for Contact Print Microlithography
	A.A. Darhuber, S.M. Miller, S.M. Troian and S. Wagner
	Princeton University, U.S.A.
-	Full-chip Process Simulation for Silicon DRC
	E. Sahouria, Y. Granik, N. Cobb and O. Toublan
	Mentor Graphics Corporation, U.S.A.
-	Systematic Design and Optimization of Multi-Material, Multi-Degree-of-Freedom Micro Actuators
	O. Sigmund
	Technical University of Denmark, Denmark
-	Robust Ion-Implantation Process Design through Statistical Analysis
	C. Sudhama, R. Thoma, M. Morris, J. Christiansen and I-S. Lim
	Motorola Digital DNA Labs, U.S.A.
-	Modeling of Ultra-low Energy Ion Implantation by Monte-Carlo Method
	Y. Ban, S. Yoon, O. Kwon and T. Won
	Inha University, Korea
-	Two-Dimensional Simulation of Scanning Capacitance Microscopy Measurements of Arbitrary Doping Profiles
	L. Ciampolini, M. Ciappa, P. Malberti and W. Fichtner
	Swiss Federal Institute of Technology, Switzerland
-	Systematic Global Calibration of a Process Simulator
	J-H. Lee, K-D. Kim, J-T. Kong, S-W. Lee, Y-W. Kim and D-H. Baek
	Samsung Electronics Co.Ltd., Korea
-	Modeling of the Self-Limiting Oxidation for Nanofabrication of Si
	Y. Chen
	University of California, U.S.A.
-	On 2D/3D Numerical Oxidation Modeling: Calibration and Investigation of Silicon Crystal Orientation Effect on Stresses in Shallow Trench Isolations
	T. Hoffmann, K.F. Dombrowski and V. Senez
	IEMN-ISEN, UMR CNRS, France
-	Simulation of Orientation-Dependent Etching of Silicon Using a New Step Flow Model of 3D Structuring
	A. Horn, H. Schröder, E. Obermeier and G. Wachutka
	Munich University of Technology, Germany
-	Strength of Nanoscale Copper Connection Under Shear
	P. Heino
	Tampere University of Technology, Finland
-	Modeling the Microstructure and Elastic Properties of Complex Materials
	A.P. Roberts and E.J. Garboczi
	University of Queensland, Australia
-	Pre-Physical Design Analysis and Optimization of Repeaters Based on Technology Node, Materials, Devices, and Repeater Options
	W.T. Lynch
	Independent Consultant, U.S.A.
-	Modeling of Focused Ion Beam Trimming of Cantilever Beams
	T. Lam and R.B. Darling
	Univeristy of Washington, U.S.A.
-	Self-Adapting Vertices for Mask-Layout Synthesis
	C-Y. Lee and E.K. Antonsson
	California Institute of Technology, U.S.A.
-	Computer Simulation from Electron Beam Lithography to Optical Lithography
	Z. Cui
	Rutherford Appleton Laboratory, United Kingdom
ISBN:	0-9666135-7-0
Pages:	741
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