 | MSM 2000
Technical Proceedings of the 2000 International Conference on Modeling and Simulation of Microsystems
Chapter 2: Process Modeling |
| - | Automated Mask-Layout and Process Synthesis for MEMS |
| | L. Ma and E.K. Antonsson |
| | California Institute of Technology, US |
| - | Creation of 3D Surface Models from 2D Layouts for BEM Anaylysis |
| | M. Spasojevic, P. Ljung and M. Bächtold |
| | Coyote Systems, Inc., US |
| - | Process Simulation for Contact Print Microlithography |
| | A.A. Darhuber, S.M. Miller, S.M. Troian and S. Wagner |
| | Princeton University, US |
| - | Full-chip Process Simulation for Silicon DRC |
| | E. Sahouria, Y. Granik, N. Cobb and O. Toublan |
| | Mentor Graphics Corporation, US |
| - | Systematic Design and Optimization of Multi-Material, Multi-Degree-of-Freedom Micro Actuators |
| | O. Sigmund |
| | Technical University of Denmark, DK |
| - | Robust Ion-Implantation Process Design through Statistical Analysis |
| | C. Sudhama, R. Thoma, M. Morris, J. Christiansen and I-S. Lim |
| | Motorola Digital DNA Labs, US |
| - | Modeling of Ultra-low Energy Ion Implantation by Monte-Carlo Method |
| | Y. Ban, S. Yoon, O. Kwon and T. Won |
| | Inha University, KR |
| - | Two-Dimensional Simulation of Scanning Capacitance Microscopy Measurements of Arbitrary Doping Profiles |
| | L. Ciampolini, M. Ciappa, P. Malberti and W. Fichtner |
| | Swiss Federal Institute of Technology, CH |
| - | Systematic Global Calibration of a Process Simulator |
| | J-H. Lee, K-D. Kim, J-T. Kong, S-W. Lee, Y-W. Kim and D-H. Baek |
| | Samsung Electronics Co.Ltd., KR |
| - | Modeling of the Self-Limiting Oxidation for Nanofabrication of Si |
| | Y. Chen |
| | University of California, US |
| - | On 2D/3D Numerical Oxidation Modeling: Calibration and Investigation of Silicon Crystal Orientation Effect on Stresses in Shallow Trench Isolations |
| | T. Hoffmann, K.F. Dombrowski and V. Senez |
| | IEMN-ISEN, UMR CNRS, FR |
| - | Simulation of Orientation-Dependent Etching of Silicon Using a New Step Flow Model of 3D Structuring |
| | A. Horn, H. Schröder, E. Obermeier and G. Wachutka |
| | Munich University of Technology, DE |
| - | Strength of Nanoscale Copper Connection Under Shear |
| | P. Heino |
| | Tampere University of Technology, FI |
| - | Modeling the Microstructure and Elastic Properties of Complex Materials |
| | A.P. Roberts and E.J. Garboczi |
| | University of Queensland, AU |
| - | Pre-Physical Design Analysis and Optimization of Repeaters Based on Technology Node, Materials, Devices, and Repeater Options |
| | W.T. Lynch |
| | Independent Consultant, US |
| - | Modeling of Focused Ion Beam Trimming of Cantilever Beams |
| | T. Lam and R.B. Darling |
| | Univeristy of Washington, US |
| - | Self-Adapting Vertices for Mask-Layout Synthesis |
| | C-Y. Lee and E.K. Antonsson |
| | California Institute of Technology, US |
| - | Computer Simulation from Electron Beam Lithography to Optical Lithography |
| | Z. Cui |
| | Rutherford Appleton Laboratory, UK |
| ISBN: | 0-9666135-7-0 |
| Pages: | 741 |
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