MSM 2000
MSM 2000
Technical Proceedings of the 2000 International Conference on Modeling and Simulation of Microsystems

Software Tools, CAD Systems Chapter 17

Wafer Fabrication Process Simulation Including Cost: Which Should be Used in an In-Line Wafer Inspection Strategy, High Sensitivity and High Cost Inspection Machine or Low Sensitivity and Low Cost Inspection Machine?

Authors: K. Nakamae, S. Yamaji and H. Fujioka

Affilation: Osaka University, Japan

Pages: 700 - 703

Keywords: wafer fabrication, inspection process, remedy, sampling inspection, particle

Abstract:
By combing an event-driven simulation method including costs and a simple VLSI particle-induced yield predictor, we discuss that which should be used in an in-line wafer inspection strategy, a high sensitivity & high cost inspection machine or a low sensitivity & low cost inspection machine. Two segments of a DRAM fab line including the inspection and the defect sourcing stages are modeled. Simulated results show that setting an adequate wafer rejection condition and selecting a proper sampling plan obtain the minimum cost per chip regardless of the kind of inspection machine.

Wafer Fabrication Process Simulation Including Cost: Which Should be Used in an In-Line Wafer Inspection Strategy, High Sensitivity and High Cost Inspection Machine or Low Sensitivity and Low Cost Inspection Machine?

ISBN: 0-9666135-7-0
Pages: 741