Nano Science and Technology Institute
Nanotech 2002 Vol. 2
Nanotech 2002 Vol. 2
Technical Proceedings of the 2002 International Conference on Computational Nanoscience and Nanotechnology
 
Chapter 14: Process Modeling
 

The Numerical Simulation of a Substractive Process for the Fabrication of 3-D Low Temperature Co-Fired Ceramics Packaging Structures and Devices: Jet Vapor Etching

Authors:I. Ramos, L. GarcĂ­a, E.W. Simoes, R. Furlan, J.J. Santiago-Aviles and M.T. Pereira
Affilation:University of Puerto Rico at Humacao, US
Pages:372 - 375
Keywords:jet vapor etching, nozzle, green tape, fluid mechanics, simulation
Abstract:We applied numerical simulation in order to gain knowledge and insight into the physical processes associated with Jet Vapor Etching, a subtractive process used in the machining of Low Temperature Co-Fired Ceramic (LTCC) tapes. Also, we performed a series of time independent (steady state) simulations of the process reactor, dividing the reactor in three parts and using the results of each part as to define the boundary conditions of the subsequent part. Furthermore we explore the dependence of the machined feature size on the pressure, temperature, distance from the micro-machined silicon nozzle to the LTCC tape, and nozzle geometry. We display velocity vector as well as density gradient profiles combined with distance dependence to substantiate the argument in our narrative.
The Numerical Simulation of a Substractive Process for the Fabrication of 3-D Low Temperature Co-Fired Ceramics Packaging Structures and Devices: Jet Vapor EtchingView PDF of paper
ISBN:0-9708275-6-3
Pages:504
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