Leading US Nano Tools Company Attracts Business From Semi Industry
Veeco Tells NWN More About Instrument OrderVeeco Instruments announced it has received a major order for its Wyko(R) SP3250(TM) Optical Profiler by a leading semiconductor packaging manufacturer for defect inspection and in-line performance monitoring. While the company cannot disclose the customer at this time, they informed NWN that its customer has facilities in Taiwan and China, and is not based in the U.S. The instrument created by Veeco provides 3D measurements of bumps or panels on flip chip substrates, and is suitable for both 400mm and 600mm panels. Ms. Jeannine Sargent, Executive Vice President, Veeco, noted, "We see high-end semiconductor packaging as an important extended market opportunity for Veeco, which reaches beyond back end bump inspection to other forms of packaging such as organic light emitting diode panels and printed electronics."
Veeco was a corporate speaker at this year’s NSTI’s Nanotech Conference in Boston. To view the 2006 program and learn more about Nanotech 2007, please visit http://www.nsti.org/Nanotech2006/