IBM and CalTech Using DNA Scaffolding For Advanced Computer Chips
Use of DNA Nanostructures Could Lead to Next Generation Chips
This month, IBM researchers and collaborator Dr. Paul W.K. Rothemund of the California Institute of Technology announced they have made advancements in combining lithographic patterning with self assembly for computer chips. The use of DNA molecules as scaffolding could provide the path to reach sub-22 nm lithography for the semiconductor industry. The DNA scaffolding was developed at CalTech, and the lithography fabrication was conducted at IBM. The full paper will be published next month, click here for the paper link.