Unique Sensor Film Minimizes Defects and Improves Quality in Wafer Bonding
US Companyâ€™s Product Shows Pressure Distribution and Magnitude of Contacting Surfaces in Bonding Fixtures
July 14, 2009
According to New Jersey-based Sensor Products Inc., their PressurexÂ® film is a quick, accurate and economical way to detect and correct pressure variations. In the wafer bonding process these pressure variations, if not corrected, can result in flaws (defects) such as unbonded wafer areas, cracked wafers, or even premature wear of the pressure plates. When placed between contacting surfaces, the film instantaneously and permanently changes color directly proportional to the actual pressure applied. Variations in pressure that lead to imperfections (or irregularities) in the bonding process can be accurately detected and corrected with PressurexÂ®-- improving yield, decreasing scrap, and boosting productivity. Precise pressure magnitude is easily determined by comparing color variation results to a color correlation chart (conceptually similar to interpreting Litmus paper).
For more information on the science behind Pressurex, please visit http://sensorprod.com/news/white-papers/2009-04_wb/index.php.