Nano Science and Technology Institute

University of Hawaii Takes Major Sponsor Role For Upcoming TechConnect Summit

TechConnect Summit Will Offer Exclusive Corporate Partnering and Technology Showcase in Heart of Silicon Valley May 23-24.

The annual TechConnect Summit, which will be held May 23-24, 2007 at the Santa Clara Convention Center, will feature dozens of pre-vetted technologies and early stage companies across multiple industries and academic disciplines from around the world. The University of Hawaii, through its Office of Technology Transfer and Economic Development, will be an exclusive Platinum Level sponsor of the Summit.

“The TechConnect Summit provides the University of Hawaii with an ideal venue to showcase our most promising technologies,” notes Richard Cox, Director of the UH Office of Technology Transfer and Economic Development. “We are looking forward to attending the Summit and meeting with members of the technology development and investment communities to present new innovations developed in Hawaii that we feel have great commercial potential.”

At the TechConnect Summit, presenters and attendees will have access to unique networking and match-making opportunities with the technology business and investment community. In addition to the IP and venture presentations, the Summit will also feature exclusive Corporate Partnering presentations from leading global companies including: Air Products & Chemicals, BASF, Genzyme, Hewlett Packard, Honda, Medtronic, Merck, and Sanyo.

TechConnect, a global technology outreach organization based in Cambridge, Massachusetts, has cultivated a one of a kind community for innovators to demonstrate their early stage developments in various technology categories and connect them with investors and enterprises looking to bring these ideas to market.

To register online, view the list of presenting organizations and early stage companies at the Summit, and meet with leading representatives from the University of Hawaii, visit: www.techconnect.org/Summit2007.

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