TechConnect Now Accepting IP and Venture Submissions For Its 2007 Summit in Silicon Valley
TechConnect Seeks Technology and Early Stage Ventures for Summit Consideration
TechConnect announced this month that it is accepting technology intellectual property (IP) and venture submissions for its upcoming TechConnect Summit 2007, to be held May 23-24 at the Santa Clara Convention Center. The TechConnect Summit is an ideal forum for both technology presenters and “pre-seed” to “early-stage” companies, giving each group the opportunity to demonstrate their technologies and market advantages before the financial and technology business community.
“The annual TechConnect Summit is unique in that it is the only venue that brings together the technical, business, and academic communities to share their ideas and explore potential investment and partnering opportunities, across multiple disciplines and industry sectors,” said Matthew Laudon, PhD, executive director and co-founder of TechConnect. “Accepted submissions will have the opportunity to network with leaders from the technology and business development communities, including TechConnect Board members, venture and corporate investors, and other potential business partners."
All submissions will be pre-screened by the TechConnect Board, which includes more than 40 members representing leading universities, companies, and investment groups from around the world. TechConnect Advisory Board Members include:
Analog Devices, Inc.|
Ford Motor Company
Imperial College London
Massachusetts Technology Transfer Center
New York University
Procter & Gamble
UC San Diego
University of California
University of Florida
University of Geneva, CH
University of Illinois
University of Michigan
University of Minnesota
University of Washington
University of Wisconsin-Madison
The 2007 TechConnect Summit will also feature exclusive Corporate Partnering Presentations from top companies representing diverse industry sectors, including:
To join the TechConnect 2007 community as a presenter, submit your IP or venture for review by the TechConnect Board. Accepted submissions will have the opportunity to present at the Summit, be featured prominently on the Summit web pages and program, and receive access to exclusive networking and matchmaking events. The submission deadline is February 2, 2007.
The TechConnect Summit will be co-located and run in conjunction with NSTI Nanotech 2007, the world’s largest nanotechnology conference and trade show. Nanotech 2007 is expected to attract more than 4,000 scientists, engineers, business development professionals, investors and government attendees from around the word.
For more details about the TechConnect Summit, including program updates and exclusive sponsor opportunities, visit www.techconnect.org/Summit2007/.