Nano Science and Technology Institute

Intel Plans to “Re-Open” Wafer Fab for New Focus on 300-mm, 65-nm Chips

Intel Corporation is preparing for the latest and accelerated ramp of advanced microprocessor lines by unveiling a newly converted fab that will produce 65-nm microprocessors and additional products on 300-mm substrates. Intel spent $2 billion to convert this fab from a 200- to 300-mm facility, and the company plans to spend a total of $4 billion on advanced 300-mm facilities. This “re-opened” fab in Arizona represents Intel’s fifth 300-mm fab, and is part of the company’s aggressive efforts to ready several new microprocessor lines based on its 65-nm process to stay ahead of pressure from rival Advanced Micro Devices Inc. (AMD). In addition to widening the door for product manufacturing, the new 300-mm fab should alleviate capacity issues for Intel; the company has been plagued by shortages in its chipset lines.

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