Wireless Integrated Microsystems (WIMS): Coming Revolution in the Gathering of Information.
This paper discusses recent developments in microsystems, including progress in low power sensing, circuit integration, wireless interfaces, and wafer-level packaging. Increasingly, such systems are realized on two or three chips in stacked configurations or embedded in silicon platforms, customized by the sensors selected and by embedded software. Microsystems for remote data collection, cortical and cochlear prostheses, and environmental monitoring are described, all based on a common architecture. Increasingly, such systems are being implemented using nanotechnology.