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Modeling and Simulation of Microsystems Committee
Committee Chairs
Microsystems Chair
- Narayan R. Aluru, University of Illinois Urbana-Champaign, USA
| Semiconductor Chair
- Andreas Wild, Freescale Semiconductor, USA
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Committee Members
- Xavier J. R. Avula, Washington University, USA
- Stephen F. Bart, Bose Corporation, USA
- Bum-Kyoo Choi, Sogang University, Korea
- Bernard Courtois, TIMA-CMP, France
- Peter Cousseau, Honeywell, USA
- Robert W. Dutton, Stanford University, USA
- Gary K. Fedder, Carnegie Mellon University, USA
- David K. Ferry, Arizona State University, USA
- Toshio Fukuda, Nagoya University, Japan
- Elena Gaura, Coventry University, UK
- Steffen Hardt, Institute of Microtechnology Mainz, Germany
- Andreas Hieke, Ciphergen Biosystems, Inc., USA
- Eberhard P. Hofer, University of Ulm, Germany
- Charles H. Hsu, MaxiMEM Limited, USA
- Michael Judy, Analog Devices, USA
- Yozo Kanda, Toyo University, Japan
- Jan G. Korvink, University of Freiburg, Germany
- Anantha Krishnan, Lawrence Livermore National Laboratory, USA
- Matthew Laudon, NSTI, USA
- Mark E. Law, University of Florida, USA
- Mary-Ann Maher, SoftMEMS, USA
- Kazunori Matsuda, Naruto University of Education, Japan
- Chris Menzel, Nano Science and Technology Institute, USA
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- Tamal Mukherjee, Carnegie Mellon University, USA
- Andrzej Napieralski, Technical University of Lodz, Poland
- Ruth Pachter, Air Force Research Laboratory, USA
- Michael G. Pecht, University of Maryland, USA
- Marcel D. Profirescu, Technical University of Bucharest, Romania
- PVM Rao, IIT Delhi, India
- Philippe Renaud, Swiss Federal Institute of Technology of Lausanne, Switzerland
- Marta Rencz, Technical University of Budapest, Hungary
- Bart Romanowicz, NSTI, USA
- Siegried Selberherr, Technical University of Vienna, Austria
- Chandra Sudhama, ON Semiconductor, USA
- Armin Sulzmann, Daimler-Chrysler, Germany
- Mathew Varghese, The Charles Stark Draper Laboratory, Inc., USA
- Dragica Vasilesca, Arizona State University, USA
- Gerhard Wachutka, Technical University of Münich, Germany
- Jacob White, Massachusetts Institute of Technology, USA
- Thomas Wiegele, BF Goodrich Aerospace, USA
- Wenjing Ye, Georgia Institute of Technology, USA
- Sung-Kie Youn, Korea Advanced Institute of Science and Technology, Korea
- Xing Zhou, Nanyang Technological University, Singapore
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Annual Symposium Synopsys
The largest gathering in the field worldwide, MSM is the
premier technical forum for presenting the latest research
and development in design, modeling and simulation methods,
tools and applications in the MEMS, microelectronic,
semiconductor, sensor, materials and biotechnology fields.
The goal of MSM is to bring together researchers, designers,
programmers and vendors involved in microsystem developments
(MEMS microelectronic, semiconductor, sensor, materials and
biotechnology fields). In an effort to dramatically shorten
development time and reduce prototyping costs, simulation
activities have experienced phenomenal growth, generating a
large number of point solutions, as well as integrated
tools.
MSM provides a forum for microsystem simulation specialists,
allowing them to be exposed to the state of the art modeling
techniques currently implemented in academic or industrial
research, encouraging a free exchange of ideas and
generating synergies between adjacent specialties. Finally,
MSM strives to help advanced modeling techniques diffuse
into industry and research centers by organizing workshops,
demonstrations and short courses.
Topics & Application Areas
- Mathematical Modeling and Scaling Laws
- Numerical Methods
- Finite and Boundary Element Methods
- Process, Device and Circuit Simulation
- Model Calibration, Validation and Metrology
- Equipment Modeling
- Co-simulation and Optimization
- System and Multi-level Modeling
- Characterization and Reliability
- Data Bases, Data Exchange and Translators
- Semiconductors and Microelectronics
- Quantum Effects, Quantum Devices and Spintronics
- Advanced Packaging and Interconnects
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- Micro Electro Mechanical Systems (MEMS)
- Smart Sensors and Structures
- Advanced Lithography and Photonics
- Biotechnology
- Genomics & Proteomics
- Microfluidics & Lab on Chip
- High Throughput Screening
- Point of Care Diagnostics
- Electromagnetics, RF, Compact Modeling and Signal Integrity
- Artificial Intelligence and Expert Systems
- CAD/CAE/CAM
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Submit Proposal or Comment to Committee Chair
We encourage you to participate and to submit your interest as either an
Scientific Committee Member or to organize a Scientific Committee*. The
NSTI will provide the infrastructure for each Industrial Committee to
organize and present a focused Symposium at the annual Nanotech
Conference and Trade Show (Nanotech 2008,
Boston, Massachusetts, June 1-5, 2008). Details will be provide upon approval of
proposal.
* All submissions will be reviewed by the NSTI Scientific Committee
Chairs and a timely response will be issued.
Back to NSTI Scientific Leadership Committees
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