Index of Keywords

W and Ni-W nanoparticle synthesis

Morphological change from nano-cube to nano-sphere by addition of Ni to W in RF thermal plasma synthesis

wafer bond

Multiple Wafer Bonding Offers Increased Throughput of High Brightness LEDs

wafer bonding

Wafer-Level High Density Multifunctional Integration (HDMI) for Low-Cost Micro/Nano/Electro-Opto/Bio Heterogeneous Systems

wafer fabrication

Wafer Fabrication Process Simulation Including Cost: Which Should be Used in an In-Line Wafer Inspection Strategy, High Sensitivity and High Cost Inspection Machine or Low Sensitivity and Low Cost Inspection Machine?

wafer level

Microcap Selective Packaging through Flip Chip Alignment

wafer level characterization

Residual Stress Dependency on Wafer Location of Thin Film PECVD Silicon Nitride

wafer level packaging

Silex offers sub 50 um pitch for through wafer connections in up to 600 um thick substrates

Silicon on ceramics - a new concept for micro-nano-integration on wafer level

wafer level vacuum packaging (WLVP)

In-Situ Assessment of Wafer-Level Hermeticity by Micromembrane Technique

wafer polishing

Direct Wafer Polishing with 5 nm Diamond

wafer scale fabrication

Wafer Scale Fabrication of Nano Probes for Atomic Force Microscopy

wafer thinning

Effect of Etchant Composition and Silicon Crystal Orientation on Etch Rate

wafer-scale integration

Wafer-scale integration of in-situ grown carbon nanotube membranes: a platform to study electrical properties


Diffusion Induced Stresses in Microstructures of MEMS

Step and Repeat UV Imprint Process Technology for Wafer-Scale Nano-Manufacturing

wall adhesion

Numerical Simulation of NIL Process Based on Continuum hypothesis


Nanoaerosol release characteristics of wallpaper coated with TiO2 nanoparticles in an air-jet simulated test chamber

warfare gas sensing

Carbon nanotubes transistors based Selective Gas sensors : from laboratory to mass production


A Study on Alleviating Deformation of MEMS Structure and Prediction of Residual Stress in Surface Micromachining


Influence of Number of Washing on the Characteristic of Nanocrystalline Copper Oxide Powders