Index of Authors

Zerrouki, R.

Functionalization of self-organized networked SiOxHyCz nano-islands deposited by atmospheric pressure microwave plasma torch on Au/Si(100) substrates patterned by nano-indentation

Zesch, J.

Energy-efficient electrochemical CO2 capture from the atmosphere

Zeto, R.J.

Modeling 3-D Fluid Flow for a MEMS Laminar Proportional Amplifier

Zeze, D.

Mapping nanomechanical phenomena of graphene nanostructures using force modulation and ultrasonic force microscopy

Zeze, D.A.

Direct nanoscale imaging of ballistic and diffusive thermal transport in graphene nanostructures

Zgol, M.

Carbon Nanotube-based Sensor Devices for IC Performance Evaluation

Novel Approach to Circuit Board Testing

Application-specific Molecular Logic Systems

Zha, L.S.

Monodisperse Thermo-responsive Composite Microgels with Core-shell Structure based on Au@Ag Bimetallic Nanorod as Core: Fabrication and Application in SERS Substrate

Zhabotinskiy, V.A.

Nanomanipulators with reduced hysteresis and interferometers build in NanoFabs

Zhabotinsky, V.A.

Standards of length at the nanoscale based on movement gages and their measurement with sub-nanometric uncertainty

Zhai, Y.

Technology Development for Large Scale Electrochemical Conversion of CO2 to Useful Products

A new strategy of using unstable offshore wind power by combination with pumped storage generation with reversible pump turbine

Zhan, S.

The study of anti-reflection coatings doped with Ag nanoparticles utilized in solar cells

Preparation and near infrared emission research of YBO3:Ce3+,Yb3+ nanosheets

Y2O3:Eu3+, Tb3+ sphere particles doped anti-reflection and wavelength conversion bifunctional films: Synthesis and application to solar cells

Zhan, S.C.

The preparation and characterization of the Graphene-Like YBO3:Ce3+

Controllable Synthesis of Monodisperse CaF2 microsphere and the investigation on luminous performance of CaF2:Ce3+/Tb3+

Zhang, A.

Modeling of Dynamic Threshold Voltage of High K Gate Stack and Application in FinFET Reliability

Field-Based 3D Capacitance Modeling for sub-45-nm On-Chip Interconnect