Index of Affiliations

Integrated Systems Engineering, Inc.

Substrate Current Simulations at Elevated Temperatures

Automatic BSIM3/4 Model Parameter Extraction with Penalty Functions

Integrated Systems Laboratory, ETHZ

A Novel Grid Adaptation Procedure for Stationary 2D Device Simulation

Integument Technologies, Inc.

Novel Nano-metal Polymeric Composites Fabricated via In-Situ Self Assembly

Intel Corp.

Halo Doping: Physical Effects and Compact Modeling

Intel Corporation

3D Simulations of Ultra-Small MOSFETs: The Role of the Short Range Coulomb Interactions and Discrete Impurities on Device Terminal Characteristics

A Novel Approach to Integrate Multiple Frequencies of Film Bulk Acoustic Resonators (FBAR) In A Single Chip

Synthesis, Encapsulation and Functionization of Composite Organic-Inorganic Nanoparticles with Distinctive Surface Enhanced Raman Signatures

Intelligent Material Solutions, Inc.

Intelligent Material Solutions Advancing Technologies

Intelligent Microsystem Center

Thermal and Load-Deflection FE Analyses of Parylene Diaphragms

IntelliSense Corporation

Numerical Simulation of Micro Assembly Techniques in MEMS Devices

Full Wave Electromagnetic Analysis and Model Order Reduction for Complex Three Dimensional Structures

Stability Criterion for Microscale Concentric Flow of Two Immiscible Liquids

International Medical University

Effect of surfactants on the size-distribution of starch nanoparticles during wet grinding

International Nanobiological Testbed Ltd.

Bioinspired Miniaturization - Stretching Information from Coherence to Dissipation for Nano-to-Micro Integrated Intelligent Systems

International Technology Center

Application-Specific Detonation Nanodiamond Particulate

Internatoinal Business Machines Corporation

A Compact Model Methodology for Device Design Uncertainty

InterScience, Inc

MEMS/MST Model Verification and Materials Parameter Extraction Using MEMSPEC-2000

Intersil Corporation

A Method for Determining the Dependence of Integrated Circuit Performance on Silicon Process, Device and Circuit Parameters

Interuniversity Microelectronics Center (IMEC)

Construction of High-performance Biosensor Interface through Solvent Controlled Self-assembly of PEG grafted Polymer