Index of Affiliations

Forschungszentrum Karlsruhe GmbH

Permittivity of BaTiO3 polymer composite with differing particle size distribution

Forschungszentrum Karlsruhe GmbH.

Simulation of Electrically-Excited Flows in Microchannels for Mixing Application

Fraunhofer ENAS

Networking in Micro/Nano Reliability Research Encouraged by EUCEMAN, the European Center for Micro- and Nanoreliability

Three-dimensional Deformation Analysis of MEMS/NEMS by means of X-ray Computer-Tomography

Fraunhofer Inst. Silicon Technology

Optimised Piezoelectric PZT Thin Film Production on 8” Silicon Wafers for Micromechanical Applications

Precision Micro-Optical Elements for Manufacturing of Gas Sensors using IR-Absorption

Fraunhofer Institut Zuverlässigkeit und Mikrointegration (IZM), Berlin

Metallic submicron wires and nanolawn for microelectronic packaging. Concept and first evaluation

Fraunhofer Institute for Applied Solid State Physics

Investigation of Stress in AlN Thin Films for Piezoelectric MEMS

Fraunhofer Institute for Biomedical Engineering

FEA Simulation of Thin Film Coils to Power Wireless Neural Interfaces

Fraunhofer Institute for Integrated Circuits

Merging Atomistic and Continuum Simulations of Silicon Technology - The Best from the Two Worlds

Combination of Analytical Models and Order Reduction Methods for System Level Modeling of Gyroscopes

Fraunhofer Institute for Interfacial Engineering and Biotechnology

Biofunctional core-shell nanoparticle deposition for biochip creation by printing processes

Fraunhofer Institute for Non-Destructive Testing

A Novel In-situ Force Measurement Method for Real Solder Joints Fatigue Evaluation

Fraunhofer Institute for Nondestructive Testing IZFP, Dresden Branch

Time-Resolved Luminescence Measurements on Up-Conversion Phosphors for Electron Beam Sterilization Monitoring

Fraunhofer Institute for Reliability and Microintegration

Residual Stress Measurements of High Spatial Resolution

Nanoscale Deformation Measurements – Concepts for Failure and Reliability Assessment at the Nanoscale

Nanoscale Resolution Deformation Measurements at Crack Tips of Nanostructured Materials and Interface Cracks

Contact-free Handling of Metallic Submicron and Nanowires for Microelectronic Packaging Applications

Fraunhofer Institute for Reliability and Microintegration (IZM)

NanoDAC/fibDAC - Nanodeformation Measurement Techniques for Reliability Analysis of MEMS and NEMS

Nanoscale Deformation Measurements for Reliability Assessment of MEMS and NEMS