
	1999 NSTI Nanotechnology Conference & Trade Show	NSTI Home \| Subscribe \| Events \| News

Nanotech 99 Technical Program - Tuesday April 20


8:30	Keynote lectures Salons II & III Session chair: Andreas Wild, Motorola

8:30	Virtual Component Qualification Michael G. Pecht, P. Sandborn, and P. McCluskey University of Maryland, USA

9:15	Coffee Condado Foyer

9:30	Special Session: Computational Extraction of Compact Model Parameters for ULSI and MEMS Salon III Session chair: Jan G. Korvink, Freiburg University, Germany

9:30	Acceleration of Inductance Extraction by Means of the Monte Carlo Method G. Leonhardt and W. Fichtner ETH-EPFL, SWITZERLAND
9:50	Accurate Inductance Extraction with Permeable Materials Using Qualocation Y. Massoud, J. Wang and J. White MIT, USA
10:10	Reduced-Order Modeling of Lorentz Force Actuation with Modal Basis Functions M. Varghese, V.L. Rabinovich, and S.D Senturia Massachusetts Institute of Technology, USA
10:30	Capacitance Extraction from Complex 3D Interconnect Structures D. Cartwright, G. Csanak, D. George, R. Walker, A. Kuprat, A. Dengi and W. Grobman Los Alamos National Laboratory, USA
10:50	A Technique for Extraction of Macro-Models in System Level Simulation of Inertial Electro-Mechanical Micro-Systems M.H. Zaman, S.F. Bart, V.L. Rabinovich, C.K. Ghaddar, I. Tchertkov and J.R. Gilbert Microcosm Technologies, Inc., USA
11:10	A Wide Frequency Range Surface Integral Formulation for 3-D Inductance and Resistance Extraction J. Wang, J. Tausch and J. White MIT, USA
11:30	Simple ADPL Implementation of a 3D FEM Simulator for Mutual Capacitances of Arbitrarily Shaped Objects Like Interconnects A. Hieke Siemens Microelectronics, USA
11:50	Extraction of Compact-Model Parameters for ULSI MOSFETs Using a Genetic Algorithm J. Watts, C. Bittner, D. Heaberlin, and J. Hoffman IBM Microelectronics Division, USA

9:30	Special Session: Front-End Salon II Session chair: Mike Masquelier, Motorola

9:30	Linking of Atomistic Modeling to Macroscopic Behavior for Front End Processes S.T. Dunham (invited) Boston University, USA
10:00	Modeling and Simulation of Non-Linear Damage Growth During Ion Implants in Silicon M-S. Son, H-J. Hwang Chung-Ang University, KOREA
10:20	Accurate Three-Dimensional Simulation of Damage Caused by Ion Implantation A. Hossinger and S. Selberherr TU Vienna, AUSTRIA
10:40	Ab-Initio TCAD Models of Dopant Diffusion in Silicon J.S. Nelson, A.F. Wright and P.A. Schultz Sandia National Laboratory, USA
11:00	Ab-Initio Pseudopotential Calculations of Boron Diffusion in Silicon W. Windl, R. Stumpf, M. Masquelier, M. Bunea and S.T. Dunham Motorola, USA
11:20	Experimental Verification of Process Models M. Law University of Florida, USA

9:30	Computational Initiatives in Biotechnology Atlantic View 1 & 2 Session chair: Dirk Bussiere, Abbott Laboratories

9:40	Structural genomics and automatic methods for macromolecular X-ray structure determination Thomas Terwilliger LANL, USA
10:25	To be announced David M. Lorber Northwestern University, Chicago, IL
11:10	Structure-based design of protein function Homme W. Hellinga Duke , USA

12:00	Lunch

15:00	Computational Initiatives in Biotechnology Atlantic View 1 & 2 Session chair: Dirk Bussiere, Abbott Laboratories

15:00	Global Description of Amino Acid & Nucleotide Sequences: Application to Predicting Protein Folds, Intron-Exon Discrimination, & RNA Gene Identification I. Dubchak, S.R. Holbrook, and I. Muchnik Lawrence Berkeley National Laboratory, USA
13:20	3D Protein Databases Integrated with Genomic and Chemical Data Mary Donlan MSI,
14:10	Reconstructing Gene Regulatory Networks from Gene Expression Data Frank Tobin SmithKline Beecham , USA

13:20	Equivalent Circuits, Behavioral and Multilevel Simulation Salon III Session chair: Bart Romanowicz, Microcosm Technologies, Inc.

13:20	Compact Large-Displacement Model for Capacitive Accelerometer T. Veijola, H. Kuisma, J. Lahdenpera Helsinki University of Technology, FINLAND
13:40	Partial-Element Equivalent-Circuit-Model Simulation for Designing RF-Wireless Communication Products with Embedded Passive Components W.R. Smith National Semiconductor Corp., USA
14:00	BSIM3 and Spice Level 3 Flicker Noise Characterization for Monolithic Integrated CMOS-Microelectomechanical Systems (MEMS) B.D. Staple, H.A. Watts, J.J. Everts, .J. Huber, F.W. Hewlett, and J.H. Smith Sandia National Laboratory, USA
14:20	Visual Modeling and Design of Microelectromechanical System (MEMS) Transducers A. Dewey and E. Icoz Duke Univeristy, USA
14:40	Coupled Package-Device Modeling for MEMS S.F. Bart, V. Rabinovich, S. Zhang, V.L. Rabinovich, and S. Cunningham Microcosm Technologies, Inc., USA
15:00	Optimized Behavioral Model of a Pressure Sensor Including the Touch-Down Effect D. Peters, S. Bechtold and R. Laur University of Bremen, GERMANY
15:20	High-Fidelity and Behavioral Simulation of Air Damping in MEMS M. Turowski, Z. Chen and A. Prezekwas CFD Research Corp., USA

13:20	Special Session: Quantum Devices Salon II Session chair: Dragica Vasileska, Arizona State University

13:20	Nonstationary Space Charge Limited Ballistic Current of Quantized Holes A.N. Korshak, Z.S. Gribnikov, and V.V. Mitin Wayne State University, USA
13:40	Complex Potentials, Dissipative Processes and General Quantum Transport D.K. Ferry, J.R. Barker and R. Akis Arizona StateUniversity, USA
14:00	Simulation Study of ZnTe-CdZnTe Based Asymmentric Step Strained Layer Quantum Well Infrared Photo-Detectors P.R. Vaya and R. Srinivasan ITT Madras, INDIA
14:20	Theory of Electron Transport in Small Semiconductor Devices Using the Pauli Master Equation M.V. Fischetti IBM Research Corp., USA
14:40	Full-Band Cellular Automata for Modeling Transport in Sub-Micrometer Devices M. Saraniti, S. Wigger and S.M. Goodnick Illinois Institute of Technology, USA
15:00	An Overview of the 3D Simulation Efforts at Arizona State University Directed Towards Understanding Transport in the Quantum Dots and the Ultra-Small Devices of the Future R. Akis, D. Vaileska, and D.K. Ferry Arizona State University, USA
15:20	Modeling On-Currents for n-MOSFETs: Ultimate Limits vs. the NTRS F. Assad, Z. Ren, D. Vasileska, S. Datta and M.S. Lundstrom Purdue University, USA

15:40	Coffee Condado Foyer

15:40	Poster Session (A) Condado Foyer

15:40	Process Modeling Condado Foyer

	A Program for Modeling of Technological Routes of VLSI Fabrication - ""ProMIC-T V. Tesluk and O. Korbetskyy Lviv Polytechnic, UKRAINE
	Simulation Support for Silicon-Bulk Microsystems Demonstrated on a Inclination Sensor Development D. Zielke GEMAC mbH, GERMANY
	Laser Induced Surface Modification of Ceramic Substrates for Thermal and Electric Lines in Microsystems: Modeling Compared to Experiment H. Gruhn, R. Heidinger, M. Rohde, S. Ruedinger, J. Schneider and K.H. Zum Gahr University of Karlsruhe, GERMANY
	Nitrous Oxide-Based Progressive Silicon Oxynitridation in Furnaces of Different Dimensions S.S. Dang and C.G. Takoudis University of Illinois - Chicago, USA
	Mask-Layout Synthesis Through an Evolutionary Algorithm H. Li and E.K. Antonsson California Institute of Technology, USA
	Surface Reconstruction of Etched Contours C-Y. Lee and E.K. Antonsson California Institute of Technology, USA
	A Novel Method to Utilize Existing TCAD Tools to Build Accurate Geometry Required for MEMS Simulation N.M. Wilson, S. Liang, P. Pinsky, and R.W. Dutton Stanford University, USA
	Design of Compensation Structures for Anisotropic Etching M.K. Long, J.W. Burdick and E.K. Antonsson California Institute of Technology, USA

15:40	Computational Materials Condado Foyer

	Development of Periodical Spatial Distribution of Donor States in Heat-Treated Silicon P. Selishchev Kyev University, UKRAINE
	Computer Molecular Dynamics and Phase Transition in Alkali Azides and Thiocyanates M.M. Ossowski and J.R. Hardy University of Nebraska, USA
	Surface Morphology and Chemically Active Sites on Ru Based Ultracapacitors: Montecarlo Simulation with Embedded Atom Potentials L. Blum, M. Legault, F.R. Zypman University of Puerto Rico, USA
	High-Field and High-Temperature Transport in n-Type 3C-SiC Y. Zhang and Y. Zhang Xidian University, CHINA
	Modeling of Oxynitride-Si System Based on Reflected Spectra K.J. Plucinski, F. Lhomme and I.V. Kityk Military University of Technology, POLAND
	A Robust Algorithm for Predicting Freezeout and Exhaustion Under Equilibrium Conditions R. Pieper and S. Michael Naval Postgraduate School,

15:40	Yeild and Reliability Condado Foyer

	A Simple VLSI Spherical Particle-Induced Yield Predictor K.Nakamae, H. Omori and H. Fujioka Osaka University, JAPAN
	Thermo-Mechanical Simulation of Wire Bonding Joints in Power Modules S. Ramminger, G. Mitic, P. Turkes and G. Wachutka Siemens AG, GERMANY
	Strength Prediction for MEMS Components Transferring Large Loads L-H. Chu, Q.Chen and G.P. Carman UCLA, USA
	Numerical Fracture Analysis of MEMS Devices N. Tayebi and A.K. Tayebi Case Western Reserve University, USA
	Rapid Reliability Assessment Using CADMP-II F.P. McCluskey and M. Pecht University of Maryland, USA
	Inductive Fault Analysis of a Microresonator T. Jiang, C. Kellon and R.D. Blanton Carnegie Mellon University, USA

15:40	Characterization, Parameter Extraction, Calibration Condado Foyer

	Numerical and Analytical Modeling of the Piezoelectric Transformer and Experimental Verification S. Hallaert, E. Sarraute, and B. Le Pioufle Laboratorire d'Electricite Signaux et Robotique, FRANCE
	SPDC: An Automatic Generator of Input Data for Process Simulators from Process Flow Data for Manufacturing T. Tatsumi, H. Ansai, M. Mukai and Y. Komatsu Sony Corp., JAPAN
	IMAP: Interferometry for Material Property Measurement in MEMS B.D. Jensen, M.P. de Boer and S.L. Miller Sandia National Laboratory, USA
	MEMS/MST Model Verification and Materials Parameter Extraction Using MEMSPEC-2000 A. Gutierrez, S. Aceto M. Simkulet, D. Patti, M. Liendhard, T. Krawczyk and A. Lundgren InterScience, Inc, USA

15:40	Numerics, Algorithims Condado Foyer

	Optimum Algorithm for Electronic System Design A. Zemliak Puebla Autonomous University, MEXICO
	Analysis of Unstable Behavior Occurring in Electro-Mechanical Microdevices E.-R. Konig and G. Wachutka Munich University of Technology, GERMANY
	Optimal Time Stepping in the Thermo-Mechanical Finite Element Simulation of IGBTs Modules Y. Tronel and W. Fichtner ETH Zurich, SWITZERLAND

15:40	Software Tools, CAD Systems Condado Foyer

	Modeling of Stress Induced Hysteresis in Pieso-Resistive Analysis H-P.Lien ISE, SWITZERLAND
	SUNRED: A Field Solver and Compact Model Generator Tool Based on Successive Node Reduction V. Szekely, A. Pahi, M. Rosenthal and M. Rencz Techical Unviersity of Budapest, HUNGARY
	Web-Based Design Tools for MEMS-Process Configuration K. Hahn and R. Bruck University of Siegen, GERMANY
	CAD Analyses of PCR Well Containment M. Deshpande, K.B. Greiner, B. Romanowicz, and J.R. Gilbert Microcosm Technologies, Inc., USA

15:40	Equivalent Circuits, Behavioral and Multilevel Simulation Condado Foyer

	A Neural Network Approach for the Identification of Micromachined Accelerometers E. Gaura, N. Steele and R.J. Rider Coventry University, UNITED KINGDOM
	Modeling A Piezo-Electric Actuator Using A Transformer Equivalent Circuit F. Oms-Elisabelar, C. Bergaud, L. Nicu, and A. Martinez CNRS, FRANCE
	Circuit Simulation of Quantum Well Bistable Laser Diodes M.G. Madhan, P.R. Vaya, and N. Gunasekaran Anna University, INDIA
	Relaxation-Based Circuit Simulation for Large Scale Circuits with Lossy Transmission Lines C-J. Chen Chinese Culture University, TAIWAN
	A Model of Photoelectric Phenomena in MOS Structures at Low Electric Fields H.M. Przewlocki Institute of Electron Technology, POLAND
	Analytical Modeling of Beam Behavior Under Different Actuations E. Sarraute and I. Dufour LESIR, FRANCE
	Electro-Mechanical Transducer for MEMS Analysis in ANSYS M. Gyimesi and D. Ostergaard ANSYS, Inc., USA
	A Methodology for System Level Simulation, Modeling and Optimization of MEMS Devices L. Nguyen, H.J. Lee, M.A. Maher and H. von Sosen Tanner Research, Inc., USA
	Model Based Identification as a New Tool to Extract Physical Parameters of Microactuators from Measurements with Error Bounds C. Rembe, E.P. Hofer and B. Tibken University of Ulm, GERMANY
	Parameterized Electrostatic Gap Model for Structured Design of Microelectroelectrical Systems M.S. Lu and G.K. Fedder Carnegie Mellon University, USA
	A Compact Model for an IC Lateral Diffused MOSFET Using the Lumped-Charge Methodology Y. Subramanian, P.O. Lauritzen and K.R. Green Texas Instruments, USA
	Compact Modeling of Bistable Electrostatic Actuators J. Xu, R.B. Darling and P.O. Lauritzen University of Washington, USA

16:40	Coffee/Wine Condado Foyer

16:40	Poster Session (B) Condado Foyer

	Semiconductor Device Modeling Condado Foyer

	Structure Optimization of 140 GHz Pulsed-Mode IMPATT Diode A. Zemliak, C. Celaya and R. Garcia Puebla Autonomous University, MEXICO
	Implementation of Strain Induced Effects in Sensor Device Simulation K. Matsuda and Y. Kanda Naruto University of Education, JAPAN
	Self Aligned Gate JFET's for Smart MEMS S. Amon, D. Vrtacnik, D. Resnik, D. Krizaj, U. Aljancic, A. Levstek University of Ljubljana, SLOVENIA
	Measuring and Characterizing Sub-Micron Short Channel LDD MOSFETs P.C. Liu and H. Lin Nanyang Technological University, SINGAPORE
	Modelling High Built-In Electric Field Effects on Generation-Recombination Rates in Space-Charge Regions of pn a-Si:H Junctions J. Furlan, Z. Gorup, F. Smole and M. Topic University of Ljublijana, SLOVENIA
	Computer Simulation of Silicon Carbide Devices Using ATLAS M. Tarplee, V. Madangarli, Q. Zhang, I. Khlebnikov, T.S. Sudarshan University of South Carolina, USA
	An Analytical Field Effect Mobility Model of N- and P-Channel Poly-Si TFTs J. Kung National Lienho College of Technology and Commerce, TAIWAN

16:40	Applications: Pressure, Actuation, Navigation Condado Foyer

	Simulation and Optimization of Variable Capacitance (VC) Micromotors, Using Modified Parallel-Plate Model A.W.A. Salman, A.Napieralski and G. Jablonski Technical University of Lodz, POLAND
	Joule Heating Simulation of Poly-Silicon Thermal Micro-Actuators D. J. Silversmtih and J.R. Reid Wayne State University, USA
	Fluctuating Amplitudes of Micro-Cantilever Vibration Modes A. Greiner, M. Fischer and J.G. Korvink Albert Ludwigs Universitat Frieburg, GERMANY
	Modeling and Design Optimization of a CMOS Compatible MEMS L. Latorre, Y. Bertrand, P. Hazard, F. Pressecq and P. Nouet LIRMM-CNRS, FRANCE
	Simulation of Nonideal Behaviour in Integrated Piezoresistive Silicon Pressure Sensors W. Romes, J. Muchow, S. Finkbeiner, J. Franz, O. Schatz, and H-P. Trah Robert Bosch GmbH , Germany
	Analytical Simulation of a 1D Single Crystal Silicon Electrostatic Micromirror H. Camon, F. Larnaudie, F. Rivoirard, and B. Jammes LAAS-CNRS, FRANCE
	Analytical Modeling of Cross-Axis Coupling in Micromechanical Springs S. Iyer, Y. Zhou, and T. Mukherjee Carnegie Mellon University, USA
	Modeling Approach for CVD-Diamond Based Mechanical Structures P. Schmid, M. Adamschik, S. Ertl, P. Gluche and E. Kohn University of Ulm, GERMANY
	A New Analytical Solution for Diaphragm Deflection and its Application to a Surface-Micromachined Pressure Sensor W.P. Eaton, F. Bitsie, J.H. Smith, D.W. Plummer Sandia National Laboratory, USA
	Modeling of SiC Lateral Resonant Devices Over a Broad Temperature Range R.G. DeAnna, S. Roy, C.A. Zorman, and M. Mehregany US Army Research Laboratory, USA
	MEMS Microactuators from Active Materials K. Bhattacharya California Institute of Technology, USA
	3-D Finite Element Modeling Schemes for Design and Simulation of VR Microactuator A. Mohamed and M. El-Hagry Electronics Research Institute, EGYPT

16:40	Applications: Electromagnetics, Optics, Imaging Condado Foyer

	Simulation of a Micro Optical Distance Sensor Realized by the LIGA Process H. Guth, A. Hellmann, I. Sieber, H. Eggert, J. Mohr, H. Nakajima, K. Tanimot and T. Usami. Forschungszentrum Karlsruhe, GERMANY
	Wavelet Transform Image Compression Prototype L. Watkins, K.R. Perry, J.S. Hurley, B. Olson, B. Pain Clark Atlanta Univeristy, USA
	Rectilinear Dynamics of Magnetically Driven Microsystems M.I. Kilani, C.J. Chen, Y. Haik and V. Pai Florida A&M University - Florida State University, USA
	System-Level Optical Models of 3-D Laser Projection Systems Using Micromirror Arrays J.Albrecht, R. Seidel, L. Melzer and D. Muller Chemnitz University of Technology, GERMANY
	Physically Rigorous Modeling of Sensing Techniques Exploiting the Thermo-Optical and Electro-Optical Effect R. Thalhammer, F. Hille, P. Scheubert, and G. Wachutka Munich University of Technology, GERMANY
	CAD for Opto-Electronic Microsystems T.P. Kurzweg, S.P. Levitan, P.J. Marchand, K.R. Prough and D.M. Chiarulli University of Pittsburgh, USA
	Simulation of Diffusive Light Exposure of LTCC Tapes and the Selection of an Optimal Grain Size Distribution P. Espinoza-Vallejos, L. Sola-Laguna and J.J. Santiago-Aviles University of Pennsylvania, USA
	A Linear Regression Scheme for Vision Systems F. Reyes and M. Orato University of Puebla, MEXICO

16:40	Applications: Microfluidics - 1 Condado Foyer

	Numerical Simulation of Boiling in a Porous Medium by Using Two-Phase Approach C. Bourbon and V. Milisic MASTER-ENSCPB, FRANCE
	Non-Isothermal Gas Flow Through Rectangular Microchannels F. Sharipov Universidade Federal do Parana, BRAZIL
	Coupled Fluid-Thermal-Structural Simulations in Microvalves and Microchannels M.M. Athavale, H.Q. Yang and A.J. Przekwas CFD Research Corp., USA
	Simulation of Micro-Channel Heat Sinks for Optoelectronic Microsystems E.W. Kreutz, N. Pirch, T. Ebert, R. Wester, B. Ollier, P. Loosen, R. Poprawe Lehrstuhl fur Lasertechnik, GERMANY
	Characterization of DNA Flow through Microchannels P.J. Shrewsbury, S.J. Muller, D. Liepmann University of California-Berkeley, USA
	The Valveless Diffuser Pump-A Numerical Design Study Using MATLAB A. Olsson, G. Stemme and E. Stemme Royal Institute of Technology, SWEDEN
	Numerical Simulations of Flat-Walled Diffuser Elements for Valveless Micropumps A. Olsson, G. Stemme and E. Stemme Royal Institute of Technology, SWEDEN

16:40	Applications: Micropumps, Heaters and Coolers Condado Foyer

	Development of CAD Model for MEMS Micropumps M. Arik, S.M. Zurn, A. Bar-Cohen, Y. Nam, D. Markus, and D. Polla Univeristy of Minnesota, USA
	Investigation of Interaction Between Subparts in Human Hemoglobin Using Concept of Conjugated Ion-Hydrogen Bonds Systems and Its Application to Biosensors Development Problem V.V.Luchinin, E.L. Demchenko, and V.A. Karasev St. Petersburg State Electrotechnical University, RUSSIA
	Nanosecond Range Heating and Temperature Measurement on Thin Layers Experiment and Simulation W. Moritz, U. Roth, M. Heyde, K. Radermann, M. Reichling and J. Hartmann Humboldt Universitat zu Berlin, GERMANY
	Evaluating Adhesion Strength of Biological Molecules to Nanofabricated Structures R.K. Soong, S.J. Stelick, G.D. Bachand, and C.D. Montemangno Cornell University, USA
	Finite Element Modeling of a Microhotplate for Microfluidic Applications R.P. Manginell, D.A. Rosato, D.A. Benson and G.C. Frye-Mason Sandia National Laboratory, USA

19:00	Banquet Dinner Grand Ballroom