
	1999 NSTI Nanotechnology Conference & Trade Show	NSTI Home \| Subscribe \| Events \| News

Nanotech 99 Technical Program - Monday April 19

8:00	Registration

8:15	Welcome and introductory remarks Salons II & III Session chair: Andreas Wild, Motorola

8:30	Keynote lectures Salons II & III Session chair: Bernard Courtois, TIMA Laboratory, France

8:30	Fast Algorithms For 3-D Simulation Jacob White Massachusetts Institute of Technology,, USA
9:15	Living in an Expanding TCAD Space Len Borucki Motorola, USA

10:00	Coffee Condado Foyer

10:20	Computational Materials Salon II Session chair: Andreas Wild, Motorola

10:40	Template Recognition of Organosiloxane Stereoregular Macrocycles. Computational and Experimental Modeling of Sol-Gel Systems Formation T.V. Timofeeva, R.D. Clark, O.I. Shchegolikhina and N.L. Allinger New Mexico Highlands University, USA
11:00	New Materials Design. Free-Base Porphyrin and Its Meso-Tetrahalogenated Derivatives K.A. Nguyen and R. Pachter Air Force Research Laboratory, USA
11:20	Multiscale Modeling of Polycrystalline Diamond O.A. Shenderova, D.W. Brenner, A. Omeltchenko, X. Su, L.H. Yang, and A. Nazarov North Carolina State University, USA
11:40	Mesoscopic Breathing Sphere Model for Computer Simulation of Laser Ablation and Damage L. Zhigilei and B. Garrison Penn State University, USA

10:20	Special Session: System-Level Modeling and Simulations of MEMS Salon III Session chair: Gary Fedder, Carnegie Mellon University

10:20	Modeling of Electrostatic MEMS Components G. Lorenz, R. Neul and S. Dickmann Robert Bosch GmbH, GERMANY
10:40	A Common Basis for Mixed-Technology Micro-System Modeling J.P. Hanna and R.G. Hillman Air Force Research Laboratory, USA
11:00	MEMS Functional Validation Using the Configuration Space Approach to Simulation and Analysis E. Sacks and J. Allen Purdue University, USA
11:20	Energy-Based Characterization of Microelectromechanical Systems (MEMS) and Component Modeling Using VHDL-AMS A. Dewey, H. Dussault, J. Hanna, E. Christen, G. Fedder, B.F. Romanowicz, and M.A. Maher Duke University, USA
11:40	MEMS Component Extraction B. Baidya, S.K. Gupta and T. Mukherjee Carnegie Mellon University, USA

12:00	Lunch

13:20	Back-End: Metallization-1 Salon II Session chair: Andrew Kuprat, Los Alamos National Laboratory

13:20	Numerical Simulations of Sputter Deposition and Etching in Trenches Using the Level Set Technique P.L. O'Sullivan, F.H. Baumann and G.H. Gilmer Lucent Technologies, USA
13:40	TopoSim3D/Grain3D: Modeling Surface Deposition and Growth J. T. Gammel and R. Walker Los Alamos National Laboratory, USA
14:00	Modeling Facet Growth of Cu Thin Films Z. Wang, Y. Li and J.B. Adams Arizona State University, USA
14:20	Computational Modeling with a New Latttice-Based Continuum Formulation for the Coupled Thermodynamic and Mechanical Equilibrium of Polycrystalline Solids L. Bassman, K. Garikipati and M. Deal Stanford University, USA

13:20	Special Session: Computational Methods for Microfluidics Salon III Session chair: Narayan Aluru, University of Illinois

13:20	Efficiency and Accuracy Improvements for FastStokes, A Precorrected-FFT Accelerated 3-D Stokes Solver W. Ye, J. Kanapka, X. Wang and J. White MIT, USA
14:00	Scaling Issues for Calculations of Low-Velocity Gaseous Microflows C.R. Kaplan and E.S. Oran Naval Research Laboratory, USA
14:20	Dynamics in Microfluidic Systems with Microheaters S. aus der Wiesche, C. Rembe, C. Maier and E.P. Hofer University of Ulm, GERMANY
15:40	Lubrication Analysis and Boundary Integral Simulations of a Viscous Micropump R.F. Day and H.A. Stone Harvard University, USA

13:20	Characterization, Parameter Extraction, Calibration Salon I Session chair: Peter Cousseau, Swiss Federal Institute of Technology

13:20	Modelling, Calibration and Validation of Contributions to Stress in the STI Process Sequence K. Garikipati, V.S. Rao, M. Yin, E. Ibok, H. I. De Wolf and R.W. Dutton Stanford University, USA
13:40	Optimal Design of Computer Experiments for the Generation of Microsystem Macromodels Using IMSET and Non-Parametric Fitting S.B. Crary, P. Cousseau, D. Armstrong, D.M. Woodcock, O. Dubochet, P. Lerch and P. Renaud University of Michigan, USA
14:00	Parameter Extraction for a Microwave Micromachined Switch J. Chen, K. Coperich, S-M Kang, and J.Schutt-Aine University of Illinois, USA
14:20	Complete Characterization of Electrostatically-Actuated Beams Including Effects of Multiple Discontinuities and Buckling E.K. Chan, K Garikipati, R.W. Dutton Stanford University, USA

14:40	Coffee Condado Foyer

15:00	Back-End: Metallization-2 Salon II Session chair: Denise George, Los Alamos National Laboratory

15:20	3D Modeling of Metallic Grain Growth D. George, N. Carlson, J. Tinka Gammel, and A. Kuprat Los Alamos National Laboratory, USA
15:00	Monte Carlo Modeling of Thin Film Deposition: Influence of Grain Boundaries on the Porosity of Barrier Layer Films J. Dalla Torre, G.H. Gilmer, D.L. Windt, F.H. Baumann, H.H. Huang, T. Diaz de la Rubia, and M. Djafari Rouhani Lucent Technologies, USA
15:40	Modelling Nucleation and Growth of Voids During Electomigration D. Richards, J.B. Adams, L. Borucki, R. Stumpf and C-L. Liu Arizona State University, USA
16:00	Molecular Dynamics Study of Thermally Induced Shear Strain in Nanoscale Copper P. Heino and E. Ristolainen Tampere University of Technology, FINLAND

15:00	Special Session: Computational Methods for Microfluidics Salon III Session chair: Narayan Aluru, University of Illinois

15:00	A Fast 3D Solver for Unsteady Stokes Flow with Applications to Micro-Electro-Mechanical Systems W. Ye, J. Kanapka, and J. White MIT, USA
15:20	Simulation of Electroosmosis Using a Meshless Finite Point Method M.J. Mitchell and N.R. Aluru University of Illinois, USA
15:40	A Passive Fluid Valve Element for a High-Density Chemical Synthesis Machine R. M. Moroney, R. Amantea and S.E. McBride Sarnoff Corp., USA
16:00	Stability Criterion for Microscale Concentric Flow of Two Immiscible Liquids L.W. Ho, J. Marchetti and C. Gallegos IntelliSense Corp., USA

15:00	Semiconductor Device Modeling Salon I Session chair: Andreas Wild, Motorola

15:00	Modelling an NMR Probe for Magnetometry G. Boero, D. Schlaefli, P.A. Besse and R.S. Popovic EPFL, SWITZERLAND
15:20	A New Analytical Energy Relaxation Time Model for Device Simulation V. Palankovski, B. Gonzalez, H. Kosina, A. Hernandez and S. Selberherr TU Vienna, AUSTRIA
15:40	Impact of Heat Source Localization on Conduction Cooling of Silicon-on-Insulator Devices P. Sverdrup, Y.S. Ju, and K.E. Goodson Stanford University, USA
16:00	Offset Analysis in CMOS Magnetotransistors by Numerical Simulation M. Metz and H. Baltes ETH Hoenggerberg, SWITZERLAND
16:20	Simulation of the Frequency Limits of SiGe HBTs J. Gessner, F. Schwierz, H. Mau, D. Nuernbergk, M. Rossberg, and D. Schipanski Technische Universitat Ilmenau, GERMANY