Engineered Nanostructures for High Thermal Conductivity Substrates
K.K. Varanasi, P. Chamarthy, S. Chauhan, P. de Bock, T. Deng, A. Kulkarni, G. Mandrusiak, B. Rush, B. Russ, L. Denault, S. Weaver, F. Gerner, Q. Leland, K. Yerkes
Massachusetts Institute of Technology, US
Keywords: Heat pipes, Electronic Cooling, Wettability, Superhydrophobic, Superhydrophilic
Abstract:In the DARPA Thermal Ground Plane (TGP) program, GE and its partners, the University of Cincinnati and the Air Force Research Laboratory, are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. This paper presents results from Phase 1 of this program.