Probing Test of the High Density Microprobe Array with Out-Of-Plane Predeformation
T. Lai, C. Tsou, H-C Li
Feng Chia University, TW
Keywords: microprobe array, uniformity, out-of-plane
Abstract:With the rapidly develop of the IC industrial required in the high performance and scale down, the probe cards also continues evolution in order to compatibility with the IC development. Therefore, the research in the probe card was continuous development in the last few years. However, the mechanical property of the probe always concerned with the relationship between the contact force and the overdrive in the previous works, but seldom discusses the effect of the deflection uniformity of microprobe array during the probing in large area or high pin count chips. For this, we have designed and fabricated a high density microprobe array with out-of-plane predeformation by electroplating to characterize the probing efficiency.