New Applications for CMP: Solving the Technical and Business Challenges

R.L. Rhoades
Entrepix, Inc., US

Keywords: CMP, process, development, MEMS, materials, applications

Abstract:

The CMP process is being adapted for planarization of many types of devices beyond traditional CMOS electronics. Each new material or integration approach can require significant amounts of time and resources to develop and optimize. Several examples of these technical challenges will be presented from areas related to MEMS, direct wafer bonding, ultrathin substrates, etc. A business model will also be described highlighting a cost-effective approach to development through outsourcing of the CMP process module. Examples will be shared demonstrating substantial timeline acceleration, cost savings, and capital preservation.