2008 NSTI Nanotechnology Conference and Trade Show - Nanotech 2008 - 11th Annual
Technical Conferences
Merck Corporate Needs
NanoInk Symposium
Nano Electronics & Photonics
Nano Fabrication
MEMS & NEMS
Sensors & Systems
Micro & Nano Fluidics
MSM - Modeling Microsystems
WCM - Compact Modeling
Nanostructured Materials & Devices
Soft Nanotechnologies & Applications
Nanoparticles in Soft Materials - Colloidal Systems
Polymer Nanotechnology
Carbon Nano Structures & Devices
Nano Particles & Applications
Composites
Nanostructured Surfaces and Interfaces
Nanoscale Characterization
Energy Technologies & Applications
Nanotech in Health, Environment & Society
ICCN - Nanoscale Modeling
Nanoreliability
Bio Nano Materials & Tissues
Bio Sensors & Diagnostics
Biomarkers & Nanoparticles
Cancer Diagnostics, Imaging & Treatment
Drug Delivery & Therapeutics
Nano Medicine
Nanotech to Neurology
Phage Nanobiotechnology
Clean Technology 2008
Industrial Impact Workshop
Confirmed Speakers
Program Committee
Reviewers

Partnering Events:

TechConnect Summit
Clean Technology 2008

Nanoreliability

Nanoreliability

Symposium Chair

Juergen Keller Jürgen Keller
Fraunhofer Institut für Zuverlässigkeit und Mikrointegration IZM
Micro Materials Center Berlin, Germany

Symposium Sessions

 

Monday June 2

 

Tuesday June 3

 

Wednesday June 4

 

Thursday June 5

10:30 Nanoreliability
 

Symposium Program

 

Thursday June 5

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10:30 NanoreliabilityRoom 308
 Session chair: Jürgen Keller, Fraunhofer Institut Berlin, DE
10:30 Synthesis, Reliability and Applications of Nanocrystalline CVD-grown Diamond and MicroDevice Fabrication
M. Wiora, K. Brühne, A.C. Flöter, P. Gluche, H-J. Fecht, University of Ulm, DE
10:50 Residual Stress Measurements of High Spatial Resolution
D. Vogel, F. Luczak, B. Michel, Fraunhofer Institute for Reliability and Microintegration, DE
11:10 Metallic submicron wires and nanolawn for microelectronic packaging. Concept and first evaluation
S. Fiedler, M. Zwanzig, R. Schmidt, W. Scheel, Fraunhofer Institut Zuverlässigkeit und Mikrointegration (IZM), Berlin, DE
11:30 Thermal Cycling of 300 nm Buried Damascene Copper Interconnect Lines by Joule Heating
D.T. Read, R.H. Geiss, National Institute of Standards and Technology, US
11:50 The Roadmap for Non-Destructive Nano Evaluation (nanoEVA) for electronic devices
N. Meyendorf, B. Koehler, F. Schubert, H. Heuer, Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren, DE
12:10 Nanoscale Deformation Measurements – Concepts for Failure and Reliability Assessment at the Nanoscale
B. Michel, A. Gollhardt, J. Keller, Fraunhofer Institute for Reliability and Microintegration, DE
 

Special Symposium

Driving forces in microelectronics are the miniaturization processes with steadily increasing service temperatures, temperature gradients and cooling requirements. With this drive new processes and technologies are developed to achieve highly localized tailored thermo mechanical properties. This has been developed down to the nanoscale in frontend processes of the chip industry.

From the material point of view newly developed nanostructured materials, nanoparticle or nanotube filled structural materials are finding their application in electronics packaging as underfil of thermal interface materials.

In addition with the emerging sector of bionanotechnology, the development and evaluation of interface concepts of biological structures to microelectronic materials such as polymers, metals, ceramics and semi-conducting materials will be a fundamental challenge.

Simulative and experimental methods for the reliability assessment of products with nanotechnological processes or functionalities are the key for successful product design.

The symposium is focussed on reliability tasks of chip design, MEMS and NEMS were nano or microstructural effects are dominating factors for reliability and lifetime. Novel testing methods for thermo mechanical characterization of the building blocks of nanotechnology are also addressed. Nanoreliability approaches from other sectors are also welcome to provide an overview of experimental and numerical concepts for nanotechnology applications.

Topics & Application Areas

Online abstract submissions are now being accepted. Proposed topics include, but are not be limited to:

  • Reliability of MEMS, Microsystems, Sensors, Mechatronic Systems
  • Reliability of Microelecronic Components and Systems
  • Reliability in Nanoelectronics
  • Reliability in Automotive Electronics
  • Reliability in IT Applications
  • Reliability - Experiments, Testing Methods and Techniques at the Nano Scale
  • Design for Reliability
  • Physics of Failure Methods
  • Reliability Concepts on Micro- and Nanoscale
  • Reliability Simulation
  • Reliability Monitoring and Diagnostics
  • Fracture, Cracks (e.g. Interface Cracking)
  • Creep, Fatigue, Thermal Fatigue and Combined Loading
  • Coupled Field Reliability Applications (Mechanical, Thermal, Electrical, Diffusion, Vibration etc.)
  • Mechanical and Thermal Reliability, Thermal Mismatch
  • Micromaterials, Nanomaterials and related Reliability Issues
  • High Resolution Stress and Strain Analysis for Reliability Applications
  • Micro- and Nano Packaging, Reliability Strategies
  • Advanced Micro- and Nanomaterials Testing
  • Nanobiotechnology and Reliability Issues
  • Reliability and Standarization in the Micro-Nano Region
  • Other

Journal Submissions

Journal of Experimental Nanoscience

Journal of Experimental Nanoscience

Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of the Journal of Experimental Nanoscience. The journal provides a showcase for advances in the experimental sciences underlying nanotechnology and nanomaterials.

For consideration into this Special Issue of the Journal of Experimental Nanoscience, please select the “Submit to Journal of Experimental Nanoscience” button during the on-line submission procedure. You may only select a single journal during the submission process.

Molecular Simulation

Molecular Simulation

Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of Molecular Simulation. The journal covers all aspects of research related to, or of importance to, molecular modelling and simulation (including informatics, theoretical and experimental work).

For consideration into this Special Issue of Molecular Simulations, please select the “Submit to Molecular Simulation” button during the on-line submission procedure. You may only select a single journal during the submission process.

Journal of Nanoparticle Research

Journal of Nanoparticle Research

Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of Journal of Nanoparticle Research. The journal disseminates knowledge of the physical, chemical and biological phenomena and processes in nanoscale structures.

For consideration into this Special Issue of Journal of Nanoparticle Research, please select the “Submit to Journal of Nanoparticle Research” button during the on-line submission procedure. You may only select a single journal during the submission process.