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Partnering Events:
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Nanoreliability
Symposium Sessions |
| | Monday June 2 |
| | Tuesday June 3 |
| | Wednesday June 4 |
| | Thursday June 5 |
| 10:30 | Nanoreliability |
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Symposium Program |
| | Thursday June 5 |
| Back to Top |
| 10:30 |
Nanoreliability | Room 204 |
| 10:30 |
Synthesis, Reliability and Applications of Nanocrystalline CVD-grown Diamond and MicroDevice Fabrication
M. Wiora, K. Brühne, A.C. Flöter, P. Gluche, H-J. Fecht, University of Ulm, DE |
| 10:50 |
Residual Stress Measurements of High Spatial Resolution
D. Vogel, F. Luczak, B. Michel, Fraunhofer Institute for Reliability and Microintegration, DE |
| 11:10 |
Metallic submicron wires and nanolawn for microelectronic packaging. Concept and first evaluation
S. Fiedler, M. Zwanzig, R. Schmidt, W. Scheel, Fraunhofer Institut Zuverlässigkeit und Mikrointegration (IZM), Berlin, DE |
| 11:30 |
Thermal Cycling of 300 nm Buried Damascene Copper Interconnect Lines by Joule Heating
D.T. Read, R.H. Geiss, National Institute of Standards and Technology, US |
| 11:50 |
The Roadmap for Non-Destructive Nano Evaluation (nanoEVA) for electronic devices
N. Meyendorf, B. Koehler, F. Schubert, H. Heuer, Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren, DE |
| 12:10 |
Nanoscale Deformation Measurements – Concepts for Failure and Reliability Assessment at the Nanoscale
B. Michel, A. Gollhardt, J. Keller, Fraunhofer Institute for Reliability and Microintegration, DE |
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Special Symposium
Driving forces in microelectronics are the miniaturization processes with steadily increasing service temperatures, temperature gradients and cooling requirements. With this drive new processes and technologies are developed to achieve highly localized tailored thermo mechanical properties. This has been developed down to the nanoscale in frontend processes of the chip industry.
From the material point of view newly developed nanostructured materials, nanoparticle or nanotube filled structural materials are finding their application in electronics packaging as underfil of thermal interface materials.
In addition with the emerging sector of bionanotechnology, the development and evaluation of interface concepts of biological structures to microelectronic materials such as polymers, metals, ceramics and semi-conducting materials will be a fundamental challenge.
Simulative and experimental methods for the reliability assessment of products with nanotechnological processes or functionalities are the key for successful product design.
The symposium is focussed on reliability tasks of chip design, MEMS and NEMS were nano or microstructural effects are dominating factors for reliability and lifetime. Novel testing methods for thermo mechanical characterization of the building blocks of nanotechnology are also addressed. Nanoreliability approaches from other sectors are also welcome to provide an overview of experimental and numerical concepts for nanotechnology applications.
Topics & Application Areas
- Reliability of MEMS, Microsystems, Sensors, Mechatronic Systems
- Reliability of Microelecronic Components and Systems
- Reliability in Nanoelectronics
- Reliability in Automotive Electronics
- Reliability in IT Applications
- Reliability - Experiments, Testing Methods and Techniques at the Nano Scale
- Design for Reliability
- Physics of Failure Methods
- Reliability Concepts on Micro- and Nanoscale
- Reliability Simulation
- Reliability Monitoring and Diagnostics
- Fracture, Cracks (e.g. Interface Cracking)
- Creep, Fatigue, Thermal Fatigue and Combined Loading
- Coupled Field Reliability Applications (Mechanical, Thermal, Electrical, Diffusion, Vibration etc.)
- Mechanical and Thermal Reliability, Thermal Mismatch
- Micromaterials, Nanomaterials and related Reliability Issues
- High Resolution Stress and Strain Analysis for Reliability Applications
- Micro- and Nano Packaging, Reliability Strategies
- Advanced Micro- and Nanomaterials Testing
- Nanobiotechnology and Reliability Issues
- Reliability and Standarization in the Micro-Nano Region
- Other
Journal Submissions
Journal of Experimental Nanoscience
Selected Nanotech Proceedings papers will be reviewed
and invited into a Special Issue of the Journal of Experimental Nanoscience.
The journal provides a showcase for advances in the experimental
sciences underlying nanotechnology and nanomaterials.
For consideration into this Special Issue of the Journal of
Experimental Nanoscience, please select the “Submit to Journal of
Experimental Nanoscience” button during the on-line submission
procedure. You may only select a single journal during the submission
process.
Molecular Simulation
Selected Nanotech Proceedings papers will be reviewed
and invited into a Special Issue of Molecular Simulation.
The journal covers all aspects of research related to, or of importance
to, molecular modelling and simulation (including informatics,
theoretical and experimental work).
For consideration into this Special Issue of Molecular Simulations,
please select the “Submit to Molecular Simulation” button during the
on-line submission procedure. You may only select a single journal
during the submission process.
Journal of Nanoparticle Research
Selected Nanotech Proceedings papers will be reviewed and invited into a
Special Issue of Journal of Nanoparticle Research.
The journal disseminates knowledge of the physical, chemical and
biological phenomena and processes in nanoscale structures.
For consideration into this Special Issue of Journal of Nanoparticle
Research, please select the “Submit to Journal of Nanoparticle Research”
button during the on-line submission procedure. You may only select a
single journal during the submission process.
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