2008 NSTI Nanotechnology Conference and Trade Show - Nanotech 2008 - 11th Annual

Partnering Events:

TechConnect Summit
Clean Technology 2008

High bending stiffness paperboard laminates with reduced weight

G. Jogikalmath, L. Reis, D. Soane
NanoPaper LLC, US

Keywords:
packaging, high stiffness, paperboard, low density, foams

Abstract:
High bending stiffness is desirable in many paper and paperboard applications. This property is often achieved by manufacturing dense, high caliper sheets or boards. In addition to consuming large amounts of pulp, such paperboards or sheets must be subsequently fluted and glued to prepare high stiffness laminates. In this presentation, we demonstrate a single step process where laminates with high stiffness and reduced weight are created by using inexpensive materials which are environmentally benign and biodegradable. Our process uses inexpensive expandable fillers and foam forming materials that expand in situ during laminate manufacturing. The foamed core imparts high bending stiffness to these specially engineered laminates. The foam density and cell size are easily tunable, leading to precise control over stiffness and cost. Furthermore the foam forming materials are surface modified to impart different surface properties such as hydrophobicity and oleophobicity to the paperboard. The foam structure also offers significant advantages in applications where sound damping and thermal insulation are required. Finally certain grades of our laminates are made using materials approved for food contact. Initial results show a 2x improvement in basis weight compared to commercially available paperboards of comparable stiffness.


Nanotech 2008 Conference Program Abstract