2008 NSTI Nanotechnology Conference and Trade Show - Nanotech 2008 - 11th Annual

Partnering Events:

TechConnect Summit
Clean Technology 2008

Nano-Technology for Heterogeneous System Integration

R. Aschenbrenner, K.-D. Lang, H. Reichl
Fraunhofer Institute for Reliability and Microintegration, DE

Keywords:
microtechnology, integration, CNT, microelectronics

Abstract:
Microelectronics miniaturization is following Moore’s law since the mid sixties and over the years it has always been possible to follow it without meeting fundamental technological limits. This might be in question for future applications, where SIA roadmap shows a red brick wall for the further development of microelectronics without fundamentally new approaches. New approaches like single electron and CNT based transistors do all target on maximum integration on chip level, leading to increased interconnect density and thus to a miniaturization of the individual contact. In parallel to this miniaturization of interconnects, the development of an adapted packaging technology is necessary to provide reliable interconnects from the nano- and micro-scale to the meso-world, where microsystems are used. At Fraunhofer IZM various approaches towards such miniaturized technologies are followed, integrating material modifications by functional nano particles with moisture barrier, magnetic and dielectric functionality. Also the nano- coating of bond wires, nano-structured bond pad surfaces and the optimization of fluxes for improved interconnect formation. For the handling of micro- and nano-scale devices contactless assembly processes are investigated, comprising electrophoresis, electrowetting or magnetic handling. Experimental work is backed by theoretical investigations dealing with molecular modeling of diffusion processes and electrical modeling of nano-scale devices as single carbon nano tubes. The continuous miniaturization in microelectronics and the development of new functional nanoscaled components, useful for information processing and microelectronics, require the integration of suitable handling methods into the technological toolbox of contemporary heterogeneous integration. With the technologies described it is intended to evaluate and to adapt known principles of touchles microparticle handling for the benefit of future microelectronic packaging.


Nanotech 2008 Conference Program Abstract