2008 NSTI Nanotechnology Conference and Trade Show - Nanotech 2008 - 11th Annual

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TechConnect Summit
Clean Technology 2008

Refined coarse-grain modeling of stamp deformation in nanoimprint lithography

S. Merino, A. Retolaza, A. Juarros, H. Schift, V. Sirotkin, A. Svintsov, S. Zaitsev

thermal NIL, nanoimprint lithography, coarse grain simulation

The inhomogeneous distribution of the residual layer thickness is a vital issue in nanoimprint lithography (NIL). Using the simulation of NIL, this problem can be alleviated by optimizing the stamp geometry and by choosing process parameters. Recently a coarse-grain software for modeling of NIL process has been presented. The software takes into account the stamp bending during squeeze flow and is able to predict the distribution of the residual resist thickness with an accuracy better than 10%. The software is based on the model in which for the calculation of the deformation, the stamp is represented as semi-infinite region (an elastic medium bounded by a plane). On the other hand a dramatic effect of the stamp thickness on the distribution of the residual resist thickness has been described. Here refined coarse-grain software is tested. This version of the software takes into account the composition and elastic properties of the imprint setup (the stamp + a “pressure buffer layer”). It is shown that for the 1000 mm stamp the experimental and simulated results agree very closely. Slightly worse agreement is observed for the 400 mm stamp. The reason is the lack of information about the exact elastic properties of the “pressure buffer layer”.

Nanotech 2008 Conference Program Abstract