2008 NSTI Nanotechnology Conference and Trade Show - Nanotech 2008 - 11th Annual

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TechConnect Summit
Clean Technology 2008

Preparation of Copper-Bearing Nanofluids for Thermal Applications

A.F. Velasco, O.J. Perales-Perez, G. GutiƩrrez
University of Puerto Rico, PR

Keywords:
nanoparticles, nanofluids, copper, thermal applications

Abstract:
Stable suspension of nanometer solid particles in suitable solvents, so-called nanofluids, has shown enhanced thermal conductivity when compared with the fluid base. This feature enables these suspensions to be considered a promising material for efficient and effective thermal management in different systems, [1-4]. Nanofluids bearing metal nanoparticles, e. g. Ag or Cu exhibit, in general, more remarkable thermal conductivity than those containing oxide nanoparticles [5-7]. Accordingly, the present research is focused on the optimization of the size-controlled synthesis conditions of Cu nanoparticles and their subsequent stabilization in ethylene glycol. The thermal conductivity of these suspensions will be measured as a function of nanoparticle size and nanoparticle volumetric load in the suspending media. Cu nanoparticles have been synthesized through the reduction of Cu ions by hydrazine as well as by taking advantage of the reducing power of polyol solutions. Solid products were then characterized by XRD, SEM and TEM techniques. The preparation of the copper-bearing stable nanofluids is attempted by coating nanoparticles with surfactant agents followed by their dispersion in ethylene glycol.


Nanotech 2008 Conference Program Abstract