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Non traditional dicing of MEMS devices
S. Sullivan, T. Yoshikawa
DISCO Corp., JP
Keywords:
dicing, MEMS, laser, contamination, vibration, thermal, ESD
Abstract:
Dicing of MEMS contains a host of challenges. Contamination, vibration, thermal, and electrical sensitivity dictate modified or non traditional dicing processes. Focusing a laser beam inside of the silicon substrate creating a modified layer is one such non traditional dicing process. This completely dry process addresses most of the challenges to dicing MEMS. This paper will compare the SD laser process to a modified blade dicing of MEMS.
Nanotech 2008 Conference Program Abstract
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