2008 NSTI Nanotechnology Conference and Trade Show - Nanotech 2008 - 11th Annual

Partnering Events:

TechConnect Summit
Clean Technology 2008

Non traditional dicing of MEMS devices

S. Sullivan, T. Yoshikawa
DISCO Corp., JP

Keywords:
dicing, MEMS, laser, contamination, vibration, thermal, ESD

Abstract:
Dicing of MEMS contains a host of challenges. Contamination, vibration, thermal, and electrical sensitivity dictate modified or non traditional dicing processes. Focusing a laser beam inside of the silicon substrate creating a modified layer is one such non traditional dicing process. This completely dry process addresses most of the challenges to dicing MEMS. This paper will compare the SD laser process to a modified blade dicing of MEMS.


Nanotech 2008 Conference Program Abstract