2008 NSTI Nanotechnology Conference and Trade Show - Nanotech 2008 - 11th Annual

Partnering Events:

TechConnect Summit
Clean Technology 2008

Metallic submicron wires and nanolawn for microelectronic packaging. Concept and first evaluation

S. Fiedler, M. Zwanzig, R. Schmidt, W. Scheel
Fraunhofer Institut Zuverlässigkeit und Mikrointegration (IZM), Berlin, DE

Keywords:
nanolawn, flip-chip, bonding, joining

Abstract:
Starting with a brief review of submicron wire production techniques, promising applications of submicron and nano wires are discussed. Observed attractive properties of metal rod decorated metal surfaces, so called nano lawn, for low energy joining and flip chip bonding are presented. The potential of these materials for microelectronic packaging by decoration of joining parts is shown: Due to close proximity of different grain sizes in intercalated nanolawn pieces (joining partners) recrystallization phenomena can be used for fluxless joining. Thus, new strategies for electrical interconnection of functional components can be designed by choice of morphology and composition of galvanically cast metal rods and wires. The experimental proof of principle has been performed with gold nanolawn. Based on original work new applications are presented. Related use of structures decorated with submicron wires and nanowires is discussed for microsystem technology.


Nanotech 2008 Conference Program Abstract