Numerical Stress Analysis on Thermal Nano-Imprint Lithography
B-G Cho, S-Y Park, T. Won
INHA University, KR
nanoimprint lithography, stress distribution
This paper investigations the stress distribution of the polymer through numerical simulations during thermal NIL. Numerical results explained characteristic phenomena which never appear in continuous line-and-space patterning cases. We believe that numerical simulations with more accurate material properties have possibilities to agree with experiments better enough for practical use. Our simulation approach could further be extended to accommodate deformation of the stamp and the sub-polymer platen.
Nanotech 2008 Conference Program Abstract