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11th International Conference on
Modeling and Simulation of Microsystems
June 1 - 5, 2008
Hynes Convention Center
Boston, Massachusetts, U.S.A
An Interdisciplinary Integrative Forum on
Modeling, Simulation and Scientific Computing in the MEMS, Microelectronic,
Semiconductor, Sensors, Materials and Biotechnology fields.
Confirmed Invited Speakers
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Technologies for Portable Electronics
Jerry Hallmark
Manager - Energy System Technologies
Motorola - Mobile Devices
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Symposium Sessions |
| | Monday June 2 |
| | Tuesday June 3 |
| 8:30 | Keynote: Micro Systems: Sensors & Systems: MSM |
| 8:30 | WCM - 1: Bulk MOS models |
| 10:30 | Micro Systems: Micro-Nano Integration |
| | Micro Systems: MSM |
| | Wednesday June 4 |
| 10:30 | Micro Systems: MSM: Device Modeling & Characterization |
| 1:30 | Micro Systems: MSM: Process Modeling |
| 4:00 | Micro & Nano Fluidics: Design & Simulation |
| | Thursday June 5 |
| 8:30 | Micro Systems: MSM: Simulation Methods and Models |
| 10:30 | Micro Systems: MSM: Device & Circuit Simulation |
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Symposium Program |
| | Tuesday June 3 |
| Back to Top |
| 8:30 |
Keynote: Micro Systems: Sensors & Systems: MSM | Room 202 |
| | Session chair: Chris Menzel, Dimatix, Inc. |
| 8:30 |
NASA NDE Applications for Mobile MEMS Devices and Sensors
W.C. Wilson, NASA Langley Research Center, US |
| 9:00 |
Nano-Technology for Heterogeneous System Integration
R. Aschenbrenner, K.-D. Lang, H. Reichl, Fraunhofer Institute for Reliability and Microintegration, DE |
| 9:30 |
Distributed Acoustic Sensing
L. Girod, Massachusetts Institute of Technology, US |
| Back to Top |
| 8:30 |
WCM - 1: Bulk MOS models | Room 201 |
| | Session chair: Christian Enz, Swiss Center for Electronics and Microtechnology, Switzerland |
| 8:30 |
JUNCAP2 Express: an extremely efficient evaluation of the JUNCAP2 model
G.D.J. Smit, A.J. Scholten, D.B.M. Klaassen, NXP Semiconductors, NL |
| 9:00 |
Modeling of gain in advanced CMOS technologies
A. Spessot, F. Gattel, P. Fantini, A. Marmiroli, STMicroelectronics, IT |
| 9:20 |
Effective Drive Current in CMOS Inverters for Sub-45nm Technologies
J. Hu, J.E. Park, G. Freeman, H.S.P. Wong, Stanford University, US |
| 9:40 |
Process Aware Compact Model Parameter Extraction for 45 nm Process
A.P. Karmarkar, V.K. Dasarapu, A.R. Saha, G. Braun, S. Krishnamurthy, X.-W. Lin, Synopsys (India) Pvt. Ltd., IN |
| Back to Top |
| 10:30 |
Micro Systems: Micro-Nano Integration | Room 200 |
| | Session chair: Larz Heinze, VDI/VDE Innovation + Technik GmbH, DE |
| 10:30 |
Silicon on ceramics - a new concept for micro-nano-integration on wafer level
M. Fischer, H. Bartsch de Torres, B. Pawlowski, M. Mach, R. Gade, S. Barth, M. Hoffmann, J. Müller, Technische Universität Ilmenau, DE |
| 10:50 |
Modeling of Single-Walled CNT-Interconnects: A Hybrid Approach
I. Ndip, S. Guttowski, H. Reichl, Fraunhofer Institute for Reliability and Microintegration, IZM, DE |
| 11:10 |
Micro to Nano – Scaling Packaging Technologies for Future Microsystems
T. Braun, K.-F. Becker, J. Bauer, F. Hausel, B. Pahl, O. Wittler, R. Mrossko, E. Jung, A. Ostmann, M. Koch, V. Bader, C. Minge, R. Aschenbrenner, H. Reichl, Technical University Berlin, DE |
| 11:30 |
Advanced Adhesives based on Carbon Nanotube Technology
H.-J. Fecht, A. Caron, L. Kroner, F. Hennrich, A. Leson, B. Michel, M. Werner, Ulm University, DE |
| 11:50 |
Contact-free Handling of Metallic Submicron and Nanowires for Microelectronic Packaging Applications
S. Fiedler, M. Zwanzig, M.S. Jäger, M. Böttcher, Fraunhofer Institute for Reliability and Microintegration, DE |
| 12:10 |
Wireless Integrated Neural Interface Device for Chronic Neural Signal Recording
S. Kim, P. Tathiereddy, L. Rieth, R. Harrison, F. Solzbacher, University of Utah, US |
| Back to Top |
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Micro Systems: MSM | Exhibit Hall C |
| - |
Finite Element Analysis of a MEMS-Based High G Inertial Shock Sensor
Y.P. Wang, R.Q. Hsu, C.W. Wu, National Chiao Tung University, TW |
| - |
Design for Manufacturing integrated with EDA Tools
U. Triltsch, S. Büttgenbach, Technical University of Braunschweig, DE |
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Modeling Voids in Silicon
M. Hasanuzzaman, Y.M. Haddara, A.P. Knights, McMaster University, CA |
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Modeling Germanium-Silicon Interdiffusion in Silicon Germanium/Silicon Super Lattice Structures
M. Hasanuzzaman, Y.M. Haddara, A.P. Knights, McMaster University, CA |
| - |
Effect of Strain on the Oxidation Rate of Silicon Germanium Alloys
M.A. Rabie, S. Gou, Y.M. Haddara, A.P. Knights, J. Wojcik, P. Mascher, McMaster University, CA |
| - |
A Physics-Based Empirical Model for Ge Self Diffusion in Silicon Germanium Alloys
M.A. Rabie, Y.M. Haddara, McMaster University, CA |
| - |
Assessment of L-DUMGAC MOSFET for High Performance RF Applications with Intrinsic Delay and Stability as Design Tools
R. Chaujar, R. Kaur, M. Saxena, M. Gupta, R.S. Gupta, Semiconductor Devices Research Laboratory, IN |
| - |
A Continuous yet Explicit Carrier-Based Core Model for the Long Channel Undoped Surrounding-Gate MOSFETs
L. Zhang, J. He, F. Liu, J. Zhang, J. Feng, C. Ma, Peking University, CN |
| - |
Diode Parameter Extraction by a Linear Cofactor Difference Operation Method
C. Ma, B. Li, Y. Chen, L. Zhang, F. Liu, J. Feng, J. He, X. Zhang, Peking University, CN |
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A Complete Analytic Surface Potential-Based Core Model for Undoped Cylindrical Surrounding-Gate MOSFETs
J. He, J. Zhang, L. Zhang, C. Ma, M. Chan, Peking University, CN |
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A Novel Dual Gate Strained-Silicon Channel Trench Power MOSFET For Improved Performance
R.S. Saxena, M.J. Kumar, Indian Institute of Technology, New Delhi, IN |
| - |
Pre-Distortion Assessment of Workfunction Engineered Multilayer Dielectric Design of DMG ISE SON MOSFET
R. Kaur, R. Chaujar, M. Saxena, R.S. Gupta, Semiconductor Devices Research Laboratory, IN |
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Linearity Performance Enhancement of DMG AlGaN/GaN High Electron Mobility Transistor
S.P. Kumar, A. Agrawal, R. Chaujar, M. Gupta, R.S. Gupta, Semiconductor Device Research Laboratory, IN |
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Formal Verification of a MEMS Based Adaptive Cruise Control System
S. Jairam, K. Lata, S. Roy, N. Bhat, Texas Instruments India Pvt Ltd., IN |
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High-Frequency Characteristic Optimization of Heterojunction Bipolar Transistors
Y. Li, C-H Hwang, Y-C Chen, National Chiao Tung University, TW |
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From MEMS to NEMS: Modelling and characterization of the non linear dynamics of resonators, a way to enhance the dynamic range
N. Kacem, S. Hentz, H. Fontaine, V. Nguyen, M.T. Delaye, H. Blanc, P. Robert, B. Legrand, L. Buchaillot, N. Driot, R. Dufour, CEA, FR |
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Modeling and simulation of a monolithic self-actuated microsystem for fluid sampling and drug delivery
P. Zhang, G.A. Jullien, University of Calgary, CA |
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Characterization and Modeling of Capacitive Micromachined Ultrasound Transducers for Diagnostic Ultrasound
C.B. Doody, J.S. Wadhwa, D.F. Lemmerhirt, R.D. White, Tufts University, US |
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Modeling and Simulation of New Structures for Sub-millimeter Solid-state Accelerometers with Piezoresistive Sensing Elements
R. Amarasinghe, D.V. Dao, S. Sugiyama, Ritsumeikan University, JP |
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Simulation of Constant-Charge Biasing Integrated Circuit for High Reliability Capacitive RF MEMS Switch
K.H. Choi, J-B. Lee, C.L. Goldsmith, The University of Texas at Dallas, US |
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Vibration-Actuated Bistable Micromechanism for Microassembly
H-T Pham, D-A Wang, National Chung Hsing University, TW |
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Stress-induced Effects on the Depletion Layer Capacitance of Silicon
K. Matsuda, Y. Kanda, Y. Itoh, Tokushima Bunri University at Kagawa, JP |
| | Wednesday June 4 |
| Back to Top |
| 10:30 |
Micro Systems: MSM: Device Modeling & Characterization | Room 311 |
| 10:30 |
Bulk-Titanium Waveguide – a New Building Block for Microwave Planar Circuits
X.T. Huang, S. Todd, C. Ding, N.C. MacDonald, University of California at Santa Barbara, US |
| 10:50 |
Humidity sensing properties of poly(o-anisidine)/SnO2 composites as revealed by impedance spectroscopy
D. Patil, P. Patil, North Maharashtra University, IN |
| 11:10 |
The static behavior of RF MEMS capacitive switches in contact
H.M.R. Suy, R.W. Herfst, P.G. Steeneken, J. Stulemeijer and J.A. Bielen, NXP Semiconductors Research, NL |
| 11:30 |
Modeling and Design of Electrostatic Voltage Sensors Based on Micromachined Torsional Actuators
J. Dittmer, A. Dittmer, R. Judaschke, S. Büttgenbach, Technische Universität Braunschweig, DE |
| Back to Top |
| 1:30 |
Micro Systems: MSM: Process Modeling | Room 308 |
| 1:30 |
The Immersed Surfaces Technology for Reliable and Fast Setup of Microfluidics Simulation Problems
M. Icardi, D. Caviezel, D. Lakehal, ASCOMP GmbH, CH |
| 1:50 |
The IMPRINT software: quantitative prediction of process parameters for successful nanoimprint lithography
N. Kehagias, V. Reboud, C.M. Sotomayor Torres, V. Sirotkin, A. Svintsov, S. Zaitsev, IMT RAS, RU |
| 2:10 |
Design and Simulations of a Microfluidic Pump with Multiple Vibrating Membranes
K. Koombua, R.M. Pidaparti, P.W. Longest, G.M. Atkinson, Virginia Commonwealth University, US |
| Back to Top |
| 4:00 |
Micro & Nano Fluidics: Design & Simulation | Room 208 |
| 4:00 |
Optimizing Multiscale Networks for Transient Transport in Nanoporous Materials
R.H. Nilson, S.K. Griffiths, Sandia National Laboratories, US |
| 4:20 |
Ultrasound-driven viscous streaming, modelled via momentum injection
J. Packer, D. Attinger, Y. Ventikos, University of Oxford, UK |
| 4:40 |
Fluidic and Electrical Characterization of 3D Carbon Dielectrophoresis with Finite Element Analysis
R. Martinez-Duarte, E. Collado-Arredondo, S. Cito, S.O. Martinez, M. Madou, University of California, Irvine, US |
| | Thursday June 5 |
| Back to Top |
| 8:30 |
Micro Systems: MSM: Simulation Methods and Models | Room 310 |
| 8:30 |
Fast Methods for Particle Dynamics in Dielectrophoretic and Oscillatory Flow Biochips
I. Chowdhury, X. Wang, V. Jandhyala, University of Washington, US |
| 8:50 |
High-Stability Numerical Algorithm for the Simulation of Deformable Electrostatic MEMS Devices
X. Rottenberg, B. Nauwelaers, W. De Raedt, D. Elata, IMEC, BE |
| 9:10 |
Physically-Based High-Level System Model of a MEMS-Gyroscope for the Efficient Design of Control Algorithms
R. Khalilyulin, G. Schrag, G. Wachutka, Munich University of Technology, DE |
| 9:30 |
Towards an efficient multidisciplinary system-level framework for designing and modeling complex engineered microsystems
J.V. Clark, Y. Zeng, P. Jha, Purdue University, US |
| Back to Top |
| 10:30 |
Micro Systems: MSM: Device & Circuit Simulation | Room 310 |
| | Session chair: Chris Menzel, Dimatix, Inc. |
| 10:30 |
Anomalous Thermomechanical Softening-Hardening Transitions in Micro-oscillators
T. Sahai, R. Bhiladvala, A. Zehnder, Cornell University, US |
| 10:50 |
Test ASIC for Real Time Estimation of Chip Temperature
M. Szermer, Z. Kulesza, M. Janicki, A. Napieralski, Technical Univiversity of Lodz, PL |
| 11:10 |
Simulation of Field-Plate Effects on Lag and Current Collapse in GaN-based FETs
K. Itagaki, A. Nakajima, K. Horio, Shibaura Institute of Technology, JP |
| 11:30 |
First self-consistent thermal electron- phonon simulator
D. Vasileska, K. Raleva, S.M. Goodnick, Arizona State University, US |
| 11:50 |
Structure Generation for the Numerical Simulation of Nano-Scaled MOSFETs
C. Kernstock, M. Karner, O. Baumgartner, A. Gehring, S. Holzer, H. Kosina, Global TCAD Solutions, AT |
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Announcement and Call for Participation
The largest gathering in the field worldwide, MSM is the premier
technical forum for presenting the latest research and development in
design, modeling and simulation methods, tools and applications in the
MEMS, microelectronic, semiconductor, sensor, materials and
biotechnology fields.
The Nanotech 2008 Meeting, MSM & ICCN Conferences, and the WCM workshop will be held at the Santa Clara Convention Center, Santa
Clara, California, U.S.A., in the heart of the silicon valley.
The conference Technical Proceedings, consisting of articles submitted
by authors of both oral and poster presentations will, be distributed to
participants at registration.
In addition to the Technical Program, an exciting series of Social
Events are being prepared to allow attendees ample opportunity to
interact socially and enjoy the sights and sounds of the venue.
Objectives
The goal of MSM is to bring together researchers, designers, programmers
and vendors involved in microsystem developments (MEMS microelectronic,
semiconductor, sensor, materials and biotechnology fields). In an
effort to dramatically shorten development time and reduce prototyping
costs, simulation activities have experienced phenomenal growth,
generating a large number of point solutions, as well as integrated
tools.
MSM provides a forum for microsystem simulation specialists, allowing
them to be exposed to the state of the art modeling techniques currently
implemented in academic or industrial research, encouraging a free
exchange of ideas and generating synergies between adjacent specialties.
Finally, MSM strives to help advanced modeling techniques diffuse into
industry and research centers by organizing workshops, demonstrations
and short courses.
Topics and Application Areas
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Topics:
- Mathematical Modeling and Scaling Laws
- Numerical Methods
- Finite and Boundary Element Methods
- Process, Device and Circuit Simulation
- Model Calibration, Validation and Metrology
- Equipment Modeling
- Co-simulation and Optimization
- System and Multi-level Modeling
- Characterization and Reliability
- Data Bases, Data Exchange and Translators
Application Areas:
- Semiconductors and Microelectronics
- Quantum Effects, Quantum Devices and Spintronics
- Advanced Packaging and Interconnects
- Micro Electro Mechanical Systems (MEMS)
- Smart Sensors and Structures
- Advanced Lithography and Photonics
- Biotechnology
- Genomics & Proteomics
- Microfluidics & Lab on Chip
- High Throughput Screening
- Point of Care Diagnostics
- Electromagnetics, RF, Compact Modeling and Signal Integrity
- Artificial Intelligence and Expert Systems
- CAD/CAE/CAM
Conference Organization
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Technical Program Chairs
Matthew Laudon, NSTI, USA
Bart Romanowicz, NSTI, USA
Microsystems Chair
Narayan R. Aluru, University of Illinois Urbana-Champaign, USA
Semiconductor Chair
Andreas Wild, Freescale Semiconductor, USA
Program Committee
Xavier J. R. Avula, Washington University, USA
Stephen F. Bart, Bose Corporation, USA
Bum-Kyoo Choi, Sogang University, Korea
Bernard Courtois, TIMA-CMP, France
Peter Cousseau, Honeywell, USA
Robert W. Dutton, Stanford University, USA
Gary K. Fedder, Carnegie Mellon University, USA
David K. Ferry, Arizona State University, USA
Toshio Fukuda, Nagoya University, Japan
Elena Gaura, Coventry University, UK
Steffen Hardt, Leibniz Universität Hannover, Germany
Andreas Hieke, Ciphergen Biosystems, Inc., USA
Eberhard P. Hofer, University of Ulm, Germany
Charles H. Hsu, MaxiMEM Limited, USA
Michael Judy, Analog Devices, USA
Yozo Kanda, Toyo University, Japan
Jan G. Korvink, University of Freiburg, Germany
Anantha Krishnan, Defense Advanced Research Projects Agency, USA
Mark E. Law, University of Florida, USA
Mary-Ann Maher, SoftMEMS, USA
Kazunori Matsuda, Tokushima Bunri University, Japan
Chris Menzel, Nano Science and Technology Institute, USA
Tamal Mukherjee, Carnegie Mellon University, USA
Andrzej Napieralski, Technical University of Lodz, Poland
Ruth Pachter, Air Force Research Laboratory, USA
Michael G. Pecht, University of Maryland, USA
Marcel D. Profirescu, Technical University of Bucharest, Romania
PVM Rao, IIT Delhi, India
Philippe Renaud, Swiss Federal Institute of Technology of Lausanne, Switzerland
Marta Rencz, Technical University of Budapest, Hungary
Siegried Selberherr, Technical University of Vienna, Austria
Sudhama Shastri, ON Semiconductor, USA
Armin Sulzmann, Daimler-Chrysler, Germany
Mathew Varghese, The Charles Stark Draper Laboratory, Inc., USA
Dragica Vasilesca, Arizona State University, USA
Gerhard Wachutka, Technical University of Münich, Germany
Jacob White, Massachusetts Institute of Technology, USA
Thomas Wiegele, BF Goodrich Aerospace, USA
Wenjing Ye, Georgia Institute of Technology, USA
Xing Zhou, Nanyang Technological University, Singapore
Conference Operations Manager
Sarah Wenning, Nano Science and Technology Institute, USA
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Joint Electronics and Microsystems Symposia
Reflecting the rapid growth of the Micro and Nano systems fields and the
commitment and success of the respective research communities, the
Electronics and Microsystems suite of symposia at Nanotech 2008
has evolved into a premier annual event in the Micro and Nano
technologies arena.
The MEMS & NEMS , Sensors & Systems , Micro & Nano
Fluidics and MSM - Modeling Microsystems symposia will jointly
provide a whole and comprehensive forum for a multidisciplinary
community, with presentations and topics for discussion ranging from
theoretical developments through design and fabrication to
industry-oriented applications.
Smarter and smaller and ever more complex systems are being dreamt of,
which combine micro and nano system technologies with intelligence,
power supply and communication ability, at the same physical scale. Such
integrated systems are to be primarily component based and, both the
whole and the composites subject to a variety of trends. The increasing
systems complexity and multidisciplinary pose strong challenges to the
engineers involved in the modelling and fabrication of micro and
nanosystems, electronics and wireless communication domains. The
Microsystems and Electronics strand will provide valuable networking and
interaction opportunities by successfully bringing together the four
Symposia above.
World-class researchers in several focused topics of MEMS and NEMS will
present their latest research results, allowing cross-disciplinary
exchange of knowledge to further advance both technological areas. MEMS
is naturally continuing its downsizing into Nanoelectromechanical
Systems but at the same time it is indispensable in constructing
complete Nano devices and systems. MEMS and Nanotechnology are becoming
highly complimentary technologies that will significantly impact various
large industries across the globe.
Journal Submissions
On-line Journal ‘Sensors & Transducers’ (S&T e-Digest)
Selected proceedings papers in the Electronics and Microsystems Track
(MEMS & NEMS, Sensors & Systems, Micro & Nano Fluidics
symposia, and MSM conference) will be reviewed and invited into a
Special Issue of the on-line journal ‘Sensors &
Transducers’ (S&T e-Digest).
For consideration into this Special Issue of the on-line journal
‘Sensors & Transducers’, please select the “Submit
to ‘Sensors & Transducers’ (S&T e-Digest)”
button during the on-line submission procedure.
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