2007 NSTI Nanotechnology Conference and Trade Show - Nanotech 2007 - 10th Annual

Atomic Layer Deposition for Hermetic Polymer Packages

Y. Zhang, R. Yang, S.M. George and Y.C. Lee
University of Colorado, US

Keywords:
hermeticity, polymer, atomic layer deposition

Abstract:
Atomic layer deposition (ALD) can be used to coat a 25-60 nm alumina layer on polymer-based wafer level MEMS or NEMS packages. With this nano-scaled inorganic coating, the polymer packages would become hermetically sealed. This poster will present our latest results in the modeling and experimental characterization of moisture transmission through ALD-alumina layer over a polymer layer. The results confirm the superior moisture resistance. More importantly, they demonstrate the feasibility for a practical approach to test the quality of the ALD coating in an manufacturing environment.

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Nanotech 2007 Conference Program Abstract

 
 

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