2007 NSTI Nanotechnology Conference and Trade Show - Nanotech 2007 - 10th Annual

Carbon Nanotube-based Thermal Interface Material

K. Ritala
University of Washington, US

Keywords:
thermal management, heat transfer, integrated circuit packaging, thermal interface material

Abstract:
A process has been developed to integrate the high thermal conductivity of carbon nanotubes into a polymer matrix, thus creating a material with high thermal transport properties for laser and IC chip packaging.

Back to Program

Sessions Sunday Monday Tuesday Wednesday Thursday Authors Keywords

Nanotech 2007 Conference Program Abstract

 
 

Names, and logos of other organizations are the property of those organizations and not of NSTI.
This event is not open to the general public and NSTI reserves the right to refuse admission and participation to any individual.