2007 NSTI Nanotechnology Conference and Trade Show - Nanotech 2007 - 10th Annual

Thermally and Electrically Conductive Adhesive

C. Gorrichateugui
NextTechs Technologies, LLC, US

Keywords:
semiconductor chip mounting, heat sinking & systems, systems that require a rapid mount

Abstract:
Atlas Scientific proposes a flexible, single or double-sided adhesive film that adheres solely by vdW forces. The proposed film has abundant arrays of multiwalled carbon nanotubes (MWCNTs > 1010 cm-2) on a flexible substrate. The discovery makes the film advantageous to many applicationss that require a rapid mount.

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Nanotech 2007 Conference Program Abstract

 
 

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