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Conference Proceedings
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Impact of Nano-Particle (Nano-Nickel and Nano-Molybdenum) Addition on the Properties of Sn-3.8Ag-0.7Cu Interconnects
K.M. Kumar, V. Kripesh, A.A.O. Tay
National University of Singapore, SG
Keywords:
Sn-3.8Ag-0.7Cu solders, Nano particles, Creep, Tensile properties, Wetting, DSC
Abstract:
The Influence of nano particle addition such as nano-Ni and nano-Mo on the microstructure, mechanical properties, melting characteristics, wetting behavior, creep properties of the Sn-3.8Ag-0.7Cu solders was investigated. The nano particle content of the solder investigated was in the range of 0-5 wt%. The composite solders with different wt% of nano addition were synthesized using the sintering technique. Microstructure analysis revealed that the nano particles were transformed to the intermetallic compounds while processing and distributed uniformly in the β-Sn solder matrix. The nano particle reinforced solder are harder and stronger than the un reinforced counterparts. The Hardness, Yield strength, UTS, Modulus increases with the content of nanoparticle inclusion to a certain extent of the reinforcement addition. The ductility decreases with the increasing content wt%. The critical wt% of the nano particle addition is determined. The melting characteristics also were found to be influenced by nano particle addition. The tensile creep properties of the composite solder specimens were investigated; both the nano-Ni and nano-Mo addition exhibited a finer equiaxed grain microstructure. The creep resistance of the both composite solders enhanced, Compared to the bare Sn-3.8Ag-0.7Cu with out any addition. The wetting properties of the nano-composite solders were find to be superior than those of the un doped solders. The improvement might be due to the finer distribution of the IMCs distribution. The possible mechanisms responsible for the superior properties also explained in detail.
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