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Multiple Wafer Bonding Offers Increased Throughput of High Brightness LEDs

D.N. Pascual
SUSS MicroTec, US

Keywords:
wafer bond, LED, high brigthness, throughput

Abstract:
We have developed a new wafer-bonding process and equipment for significantly increasing the throughput of high-brightness light emitting diodes and other devices that could benefit from group semiconductor wafer bonding. I will present this solution in more detail while explaining the technical limitations and requisites for successful implementation. Utility of the method will be demonstrated with experimental results from previously bonded wafers.

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