Nanotechnology Conference and Trade Show - Nanotech 2006
> Program > Technical Conferences > Business & Development > Nano Impact Workshop > Nanotech Job Fair > Expo
Program
Sessions
Sunday
Monday
Tuesday
Wednesday
Thursday
Index of Authors
Index of Keywords
Confirmed Speakers
Conferences & Symposia

Conference Proceedings

Conference Technical Proceedings

A New Copper Electrodeposition Scheme to Reduce Void Defects after Chemical Mechanical Polishing

J.Y. Lin, Y.Y. Wang and C.C. Wan
National Tsing Hua University, TW

Keywords:
electroplating, CMP, orientation, pulse current, resistivity

Abstract:
Deposition of highly (111) oriented conductive layer is required for achieving better electromigration resistance and lower resistivity. Moreover, the amount of void defects decreases as the (111)/(200) ratio increases in CMP process. Hence, we investigated the influence of additives and pulse frequency on the resistivity and crystal orientation. As the pulse frequency is 100 Hz, higher ratio of (111)/(200) and lower resistivity in the present of additives is obtained. Furthermore, we propose a new deposition approach beneficial for polishing in CMP based on above optimal condition. Utilizing DC to fill the trenches in the first step previously, and then PC is applied to accomplish the whole deposition. The switched time was determined by series of filling experiments. After the switched time was determined, the whole deposition with the use of combination of DC and PC was preformed. The preformed result indicates that there is not improper during the new approach. As a result, this approach may be useful to profit CMP process.

Back to Program

Sessions Sunday Monday Tuesday Wednesday Thursday Authors

Nanotech 2006 Conference Program Abstract

 
Nanotechnology Conference | Terms of use | Privacy policy | Contact | NSTI Home
Program | Technical Conferences | Business & Development | Nano Impact Workshop | Nanotech Job Fair | Expo |
Nanotech 2006 Home | Press Room | Venue | Subscribe | Site Map
Names, and logos of other organizations are the property of those organizations and not of NSTI.
This event is not open to the general public and NSTI reserves the right to refuse admission and participation to any individual.