Progressive Cooling Solutions
Seed Level, US
Progressive Cooling Solutions (PCS), LLC is a new venture based upon silicon breakthrough technology in MEMS, developed at the University of Cincinnati, for which the founders have been significantly responsible. The company will provide superior and novel MEMS-based thermal dissipation hardware for cooling commercial micro chips and electronics that is more efficient, smaller and far more compatible and effective than other commercial systems. With ever increasing electronic chip density for computers and use of miniature high power density microwave devices for communications and IT, effective heat removal has become the ultimate limiting factor for further development. Progressive’s primary line of business is the development of intellectual property in the field of electronics cooling and the generation of revenue through licensing and business-to-business hardware sales to original equipment manufactures(OEMs).
PCS is currently in the nascent stages, but has already secured a consulting contract in the area of electronics cooling. Venture capital funding of $2.6 million is requested to fund PCS through prototyping to commercial launch of its first product offering. An award winning business plan written by the founders is currently being presented around the US, and would be a great addtion to Nanotech 2006.
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Nanotech 2006 Conference Program Abstract