Seed Level, SE
Smoltek is devoted to develop, validate and utilize state of the art nanoscale technologies for the semiconductor industry by enhancing performance, enabling new functionalities and prolonging lifetime of current and future manufacturing techniques. As microprocessors get smaller and faster, the copper interconnects transferring data in and out of these chips constitute a bottleneck. The copper interconnects fails to comply with data transfer rates due to the constraints it faces at smaller scales in terms of increased current and temperature stress. And the smaller the scale, manufacturing of copper interconnects become persistently complex and costly. For manufacturers of integrated circuits such as microprocessors, there is a pressing need of finding a new and affordable solution to replace copper interconnects. By exploring the excellent thermal and current carrying properties of carbon nanostructures, Smoltek has developed a solution to integrate them into existing CMOS technology. Smoltek’s solution will solve the interconnect dilemma for both CMOS and post-CMOS technology by enabling data transfer rates 300-400% faster than today’s copper interconnects, directing heat transport from individual devices in the microprocessor, enabling low power consumption and diminished hardware strain, utilizing existing machinery and employing less complex process steps than existing manufacturing processes.
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Nanotech 2006 Conference Program Abstract