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A Designer’s Guide to CMOS MEMS

G.K. Fedder, S. Simone and N. Sarkar
Carnegie Mellon University, US

Keywords:
CMOS, MEMS, sensors, RF

Abstract:
MEMS made through micromachining the CMOS substrate and metal/dielectric layers open a number of possibilities for design, Microstructures may have multiple beam and plate heights, with multiple electrodes, piezoresistors and heater elements. The multiple layers inside of structures may be arranged to achieve lateral and vertical self-actuation and electrothermal actuation. With this design freedom comes the burden of complexity in verification. As with all MEMS processes, CMOS MEMS has design constraints set by process limitations and material properties. Structural release is governed by context-dependent design rules with values set by test structure data. To motivate design possibilities and illustrate an automated design flow supporting CMOS MEMS, a handful of microsystem examples, including inertial sensors, gravimetric chemical sensors and RF tunable capacitors will be highlighted.

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