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Faradayic(TM) Process for Electronic Interconnect Fabrication

P. Miller
Faraday Technology Inc, US

Keywords:
integrated circuit, interconnect, package, electrodeposit, electroetch, electropolish

Abstract:
The Faradayic™ Process is a platform technology suite addressing electronic manufacturing at the integrated circuit, chip-scale/wafer-level package, and printed circuit board hierarchies. This technology is covered by fifteen issued US and foreign patents and additional patents pending. This patent estate includes apparatus and process technology.

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