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Comparison between Nanoindentation and Scratch Test Hardness (Scratch Hardness) Values of Copper Thin Films on Oxidised Silicon Substrates

S. Chowdhury, D. Beegan and M.T. Laugier
University of Alabama at Birmingham, US

Keywords:
scratch hardness, nanoindentation, copper

Abstract:
We have measured hardness i.e. scratch hardness from the scratch tester usually used for investigating adhesion in thin films and compare this with hardness measured by the nanoindentation technique on copper thin films. We defined scratch hardness as the load per unit load-bearing area during scratching, calculated from applied load and the width of the scratch obtained after the test is completed. Copper films with different thickness range (100 nm to 500 nm) have been deposited by rf magnetron sputtering on silicon substrate. Scratch hardness was determined by CSM TM scratch tester using scratch widths at low loads. The measured hardness values were compared with conventional nanoindentation hardness measurements using a CSM TM nanohardness tester. At these low indentation depths there is a good correlation between the scratch hardness and the nanoindentation hardness, with an increase in hardness as the film thickness decreases.

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